Which Power Components Need Heat Conducting Materials To Dissipate Heat

MOS tube is the electronic component with the highest heat generation besides the power chip. There are many types of thermal materials used, usually thermal silicon film, thermal silicone grease, and alumina ceramic plate.

The power management chip is responsible for the operation of the entire power supply, which usually accumulates a large amount of heat for a long time. High-power power chips have particularly high requirements for thermally conductive materials due to their powerful power supply functions. Thermally conductive silicone grease is usually used in conjunction with thermally conductive ceramics Chip to meet cooling needs.

Transformer is a tool responsible for the conversion of voltage, current and resistance. However, the structure of the transformer can only use a flowable paste medium as a thermal management material, and usually uses a thermal potting compound as the local potting material. In addition, some power supplies work in the outdoor environment for a long time, while the potting glue can handle the heat dissipation, it can also solve the problem of waterproofing and sealing. All outdoor power supplies use the overall potting for heat dissipation.

The power supply circuit can reduce the loss of current in the component, select a suitable thermally conductive material to effectively transfer the heat, and reduce the component operating temperature to ensure the reliability of the power supply to maintain the normal power supply operation, thereby achieving the purpose of extending the power supply life. More power cooling solutions are in Sheen. We have professional heat dissipation structural engineers who can provide you with a wealth of thermal materials and heat dissipation cases according to your electronic product structure.