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    silicone heat sink gap filler silicone heat sink gap filler
    silicone heat sink gap filler silicone heat sink gap filler
    silicone heat sink gap filler silicone heat sink gap filler

    SE10 Thermal Gel 1.0W/mK

    Use Range:
    SE10 1.0 W/m·K Single-Part Thermal Gel (Thermal Putty) is a silicone resin-based flexible gap filler. It features low thermal impedance, minimal oil bleeding, and excellent extrusion properties, making it ideal for filling gaps between heat-generating electronic components and heat sinks. It is soft, applies low assembly stress, and has excellent compressibility and wet-out performance, suitable for applications with complex gap thicknesses. Thickness and shape can be precisely controlled using automated dispensing equipment.

    Free Samples
    To request a sample of our one-component (1K) Thermal Gel (Thermal Liquid Gap Filler) or inquire about more product information, please email us at [email protected] or Click here.
     

    Product Description

    The SHEEN's SE Series one-component Thermal Gel are renowned for their distinctive characteristics, which include:  
    ◆ Good thermal conductivity, available in options ranging from 1.0 to 6.0 W/m·K.  
    ◆ High softness and compressibility, providing low assembly stress, ideal for delicate and sensitive electronic components.  
    ◆ Excellent flame resistance, achieving a UL94 V-0 rating.  
    ◆ Outstanding electrical insulation properties, with dielectric strength up to 8 kV/mm.  
    ◆ No cracking or dripping, ensuring good stability in both high and low-temperature environments.  
    ◆ Can be precisely controlled for thickness and shape using automated equipment.  
    ◆ Complies with RoHS, Halogen-Free, and REACH environmental and safety standards.  
     

    【Applications】

    ◆ CPUs and GPUs  
    ◆ Power Supply Units (PSUs)  
    ◆ LED Modules  
    ◆ Engine Control Units (ECUs)  
    ◆ Gaming Consoles and Laptops  
     

    Properties

    Properties Unit SE10 Test Method
    Color - Pink Visual
    Thermal Conductivity W/m·K 1.0 ASTM D5470
    Thermal Impedance(@30psi) ℃*in2/W 0.13 ASTM D5470
    Flow Rate(@30cc,90psi) g/min 90±15 -
    Minimum Interface Thickness mm 0.10 -
    Density g/cc 2.0 Helium Pycnometry
    Outgassing % < 0.5 ASTM E595
    Dielectric Strength (@AC) kV/mm > 2.0 ASTM D149
    Dielectric Constant (@1MHz) - 4.0 ASTM D150
    Volume Resistivity Ω·cm > 1012 ASTM D257
    Operating Temp. -50 ~ 150 -
    Flame Rating - V-0 UL94
    RoHS - PASS IEC 62321
    Halogen - PASS EN 14582
    REACH - PASS EN 14372
     

    About Us

    Dongguan Sheen Electronic Technology Co., Ltd.
    Founded: 2008
    Team: 110 employees
    Facility: 5,000㎡
    Focus: R&D and production of functional materials
    Strengths: Efficient, collaborative team
    Achievements: Key supplier to leading global manufacturers
    Applications: Telecom, Automotive, Medical, Computing, Industrial , Military
    Certifications: ISO9001:2015, ISO14001:2015, IATF16949:2016

     

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