Carbon Fiber Thermal Pad Series

1. What is a carbon fiber thermal pad?

A carbon fiber thermal pad is a high-performance thermal interface material designed to transfer heat between heat-generating components and heat dissipation hardware. The CSF Series uses directionally arranged carbon fiber to provide high thermal conductivity while maintaining flexibility, compressibility, and elasticity. The series offers thermal conductivity options from 15 to 45 W/m·K and thicknesses from 0.3 to 12.0 mm.

2. What is the thermal conductivity of CSF carbon fiber thermal pads?

The CSF Series offers thermal conductivity grades from 15 to 45 W/m·K, including CSF15, CSF20, CSF25, CSF30, CSF35, CSF40, and CSF45. Higher-conductivity grades provide lower thermal resistance under the specified test conditions, making them suitable for applications with demanding heat dissipation requirements.

3. Are CSF carbon fiber thermal pads suitable for low-pressure applications?

Yes. CSF carbon fiber thermal pads feature high compressibility, flexibility, and elasticity, making them suitable for interfaces where clamping pressure is limited. The pad conforms to surface irregularities and helps fill microscopic air gaps between mating components, improving thermal transfer across the interface.

4. What applications are CSF carbon fiber thermal pads used for?

CSF carbon fiber thermal pads are designed for applications such as chip testing, capacitors, optical modules, 5G base station RF units (RRU), and thermal module testing. They can also be customized for different component geometries and interface requirements.

5. Can CSF carbon fiber thermal pads be customized?

Yes. Sheen can customize the CSF Series according to customer requirements, including pad shape and dimensions. The material is available in thicknesses from 0.3 to 12.0 mm, allowing engineers to select a configuration based on the interface gap, thermal performance target, and assembly requirements.