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usheenthermal
Boron Nitride Thermal Pads provide an innovative cooling solution for 5G base stations, offering high thermal conductivity (12-20W/MK) and excellent electrical insulation (10¹⁴–10¹⁶Ω·cm). These advanced thermal interface materials reduce chip temperatures by 18°C, extend equipment lifespan by 2.8 years, and lower energy consumption by 15%. Ideal for harsh environments including high humidity and coastal areas, they are emerging as the preferred thermal management material for next-generation 5.5G/6G infrastructure.
Discover how high-thermal-conductivity graphene thermal pads (70W/m·K) effectively solve domain controller overheating issues. With extremely low thermal resistance (<0.1°C·in²/W), they reduce chip junction temperature by 18°C+, prevent performance throttling, and extend product lifespan 2-3×. Ideal for automotive electronics requiring vibration resistance, wide temperature range operation (-40°C to 125°C), and compact design. Learn how this advanced thermal solution enables next-generation domain controllers to maintain stable performance in intelligent vehicles.
Explore the superior performance of silicone-free thermal pads in automotive thermal management. This article details how they prevent high-temperature aging, ensure dimensional adaptability for 8-inch & 14-inch screens, eliminate silicone migration, and provide stable heat dissipation from -40°C to 120°C, extending display lifespan and reducing failure rates.
Discover how ultra-thin thermal pads break the efficiency bottleneck in PVT panels by replacing traditional EVA, insulation, and encapsulation layers. With superior thermal conductivity, insulation, and durability, these 1mm pads boost combined thermal-electrical efficiency beyond 85%, reduce costs, and enable slimmer, more versatile solar applications.
Selecting the correct thermal dissipation materials is critical for the performance and safety of commercial vehicle motor controllers. This comprehensive analysis details the use of flexible thermal pads for low-voltage controllers and high-performance thermal grease combined with robust insulating films for high-voltage systems. Understand how these specialized materials enhance heat transfer, prevent insulation breakdown, withstand extreme environmental conditions, and ultimately ensure operational stability and extended service life for electric commercial vehicles.
In industrial, medical, and communication applications, fiber lasers are crucial but face growing thermal challenges as power densities rise. Traditional silicone thermal materials release harmful oils and siloxanes at high temperatures, degrading optics and circuits. This drives the shift to non-silicon solutions that enhance cooling while eliminating contamination - ensuring reliable, long-term laser operation. We examine how these advanced thermal solutions address high-power laser challenges.
The innovative non-silicon thermal conductive gel is specially developed to solve the high-temperature failure problem of BDU in new energy vehicles. It has a tunable thermal conductivity of 1-10 W/m·K and can significantly reduce the interface thermal resistance to below 0.05 °C·cm²/W. The product has passed the UL94 V0 flame retardant certification and has excellent insulation performance (10¹⁴ Ω·cm), remaining stable in extreme environments ranging from -40°C to 150°C. In practical applications, it can improve heat dissipation efficiency by 25% and reduce the defect rate by 75%, making it an ideal choice for thermal management in the high-voltage systems of new energy vehicles.
In industrial production, high temperatures can cause industrial cameras to "go on strike", thereby affecting the detection efficiency. The silicon-free thermal phase-change sheet solves this problem with its 3-6W/MK thermal conductivity and low thermal resistance design. When heated, it turns into a semi-fluid state and adheres to the microscopic gaps, cools down and solidifies to maintain the adhesion, ensuring smooth heat conduction. The fully organic and silicon-free formula has zero volatility and does not contaminate optical components at 85℃, ensuring clear imaging. Test results show that after using a 20 million pixel camera, the sensor temperature remains below 55℃. The equipment in the vehicle inspection workshop operates efficiently for 12 consecutive hours, the false detection rate significantly decreases, a large amount of cost is saved annually, and the ultra-thin design is suitable for compact chassis.
This article presents boron nitride thermal conductive gaskets as a solution to drones' overheating issues. High temperatures from motors and chips hinder drones' stability, battery life, and durability. These gaskets offer 12-20W/MK thermal conductivity (3-6x better than traditional silicone), 2.2g/cm³ low density (60% lighter than metal sinks), and insulation (volume resistance over 10¹⁴Ω・cm) for safe heat transfer. Real cases show agricultural drones extended operation by 75% with 70% fewer faults, while industrial ones kept chips below 55℃ during 4-hour high-temperature work, breaking heat dissipation bottlenecks.
This article explains why silicone-free thermal pads are the ultimate solution for PDU heat dissipation challenges in data centers. Unlike traditional silicone pads that leak oil and cause oxidation, these innovative pads eliminate silicone migration while improving heat transfer by 30%. Their low-hardness design (Shore 00 30-50) ensures perfect contact with components, even in extreme temperatures (-40°C to 120°C), and provides high-voltage protection (≥5kV/mm). Discover how this breakthrough technology prevents overheating, reduces failures, and extends PDU lifespan—making it the smart choice for reliable power distribution.
This article explains how silicon-free ultra-soft thermal conductive materials reshape heat dissipation in optical communications. They put an end to silicone oil contamination, a critical issue for high-speed modules like 800G and beyond. With their ultra-soft nature, these materials achieve excellent interface fit, boosting heat transfer efficiency compared to traditional options. They enhance reliability, extend device lifespan, and offer long-term cost advantages, making them key for future optical communication developments like CPO architecture.
This article explores why graphene thermal pads are hailed as the savior for heat dissipation in AI data centers. It highlights the heat dissipation challenges of AI data centers, introduces graphene thermal pads' ultra-high thermal conductivity (70W/(m·K)) and excellent mechanical properties, presents practical application effects, and looks forward to their future development prospects.
Discover ideal thermal material for chip testing—high-performance carbon fiber gaskets with superior conductivity and resilience, solving heat issues, yield fluctuations, cost problems.
This article explores thermal conductive sheet selection for FPCB-PCB bonding amid electronic device miniaturization and flexibility trends. It highlights a thermal pad addressing key challenges: ≥0.8W/MK thermal conductivity for efficient heat transfer, 60% elongation with 3-7MPa strength for deformation resistance, and air-expelling capability to form gap-free channels. Stable at -40℃ to 200℃, it supports precise die-cutting and easy operation, redefining bonding standards across electronics sectors.
This article explores how graphene and boron nitride thermal pads tackle overheating in high-performance intelligent driving chips. Graphene pads, boasting 70W/MK thermal conductivity, create an "ultra-fast heat dissipation channel" for the chip's core area with 25% compression rebound rate ensuring tight fit. Boron nitride pads, with 12-20W/MK thermal conductivity and high insulation, protect surrounding circuits. Together, they build a "core + peripheral" 3D heat dissipation network, boosting efficiency by 58%, passing ASIL-D certification, and solving issues like computing power frequency reduction from high temperatures.
Sheen Technology Co., Limited.
Address: Flat/Rm 1405A 14/F The Belgian Bank Building Nos.721-725 Nathan Road MongKok KL HK
Tel: +86 13728278261
Dongguan Sheen Electronic Technology Co., Ltd.
Tel:+86-769-22479425
E-mail:Tina: marketing@u-sheen.com
WeChat/Phone: +86 13728278261
WhatsApp: +86 13542243751
Add: Room 101, 201, 301, 401, Building 2, No. 8 Hengzhutang Road, Liaobu Town, Dongguan City, Guangdong Province ,China
