Learn what thermal putty is and how it serves as a versatile thermal interface material for electronics. Explore the SE and AE series thermal gels, their key features, and applications in automotive electronics, smartphones, and more.
Learn about thermal pads, including their definition, types, benefits, and applications. Understand how these thermal interface materials improve heat dissipation and enhance the performance of electronic devices.
In-depth analysis of the manufacturing process of conductive silicone pads with silicone cloth backing, emphasizing the key role of silicone cloth in enhancing mechanical strength, dimensional stability, and operability, as well as core steps in the process. Understand the manufacturing secrets and performance enhancement strategies of high-performance thermal interface materials (TIMs).
Discover the benefits of silicone-free thermal pads for high-precision electronic cooling. This article explores the issue of silicone contamination from traditional silicone pads and highlights how silicone-free alternatives offer superior performance, reliability, and broader process compatibility, especially in sensitive applications like aerospace, medical devices, and precision optics.
In-depth analysis of the five core process challenges faced in the production of carbon fiber thermal conductive pads, providing targeted solutions. Understand the challenges and solutions for carbon fiber thermal conductive pads in uniform dispersion, interfacial bonding, high filler loading, thickness control, and cost control, contributing to the research and application of high-performance thermal management materials.
In-depth analysis of the technical characteristics, manufacturing challenges, pain points, and solutions for boron nitride and graphene thermal pads. Explore the challenges and solutions faced in the preparation and application of these two high-performance thermal conductive materials.
Discover how Sheen Technology's thermal gel solutions optimize heat dissipation in smartphones, preventing throttling, extending battery life, and improving reliability in compact mobile designs.
Discover how Sheen Technology's advanced thermal interface materials optimize data center cooling, reduce operating costs, extend equipment lifespan, and improve energy efficiency in high-density computing environments.
Discover Sheen Technology's premium thermal pad solutions, including silicon, carbon fiber, silicone-free, and phase change materials. Enhance electronic cooling efficiency and extend device lifespan.
This article delves into the causes of interfacial thermal resistance in thermal interface materials and details various optimization strategies, including surface treatment, micro-nanostructure design, and adaptive interfaces. It aims to provide engineers and researchers with practical guidance on reducing thermal resistance and improving heat dissipation performance.
Explore the comprehensive manufacturing process of thermal conductive double-sided tape, focusing on key technologies that optimize heat conduction and bonding performance. Learn about substrate selection, adhesive coating, curing treatment, and die-cutting processes to achieve reliable thermal efficiency in electronic applications.
Discover the advantages of silicone-free thermal pads in medical devices. Learn how these high-performance materials improve thermal management, reliability, and precision in imaging, diagnostic, and life support systems.
Thermal silicone pads are key materials in the thermal management systems of electronic products, and their stability and thermal conductivity directly influence the performance and lifespan of devices.
Foam silicone technology is a processing method that uses physical or chemical means to foam silicone material, forming a new functional material with a porous structure. This material has excellent properties such as light weight, high elasticity, resistance to high and low temperatures, aging resistance, sealing, and insulation.
Learn the ideal thermal gel thickness for CPUs, GPUs, LEDs, and power modules to enhance cooling efficiency and device longevity.