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usheenthermal
This article explores how low-density thermal gels revolutionize new energy vehicle thermal management with lightweight design, high thermal conductivity, and precise application. Discover technical breakthroughs in battery cooling, range optimization, fast charging performance, and safety certification for automotive-grade thermal solutions.
This article explores how high-conductivity, high-resilience carbon fiber thermal pads break through server cooling bottlenecks. Facing the challenge of kW-level chip TDP, these pads, with directional thermal conductivity of 15-45W/mK, can reduce temperature delta by over 20°C compared to traditional materials, enhancing computing reliability and preventing performance throttling. Their superior compression recovery ensures long-term low contact thermal resistance and can reduce data center cooling energy consumption by 10-15%, optimizing operational costs and PUE for efficient, green computing infrastructure.
Boron Nitride Thermal Pads provide an innovative cooling solution for 5G base stations, offering high thermal conductivity (12-20W/MK) and excellent electrical insulation (10¹⁴–10¹⁶Ω·cm). These advanced thermal interface materials reduce chip temperatures by 18°C, extend equipment lifespan by 2.8 years, and lower energy consumption by 15%. Ideal for harsh environments including high humidity and coastal areas, they are emerging as the preferred thermal management material for next-generation 5.5G/6G infrastructure.
Discover how high-thermal-conductivity graphene thermal pads (70W/m·K) effectively solve domain controller overheating issues. With extremely low thermal resistance (<0.1°C·in²/W), they reduce chip junction temperature by 18°C+, prevent performance throttling, and extend product lifespan 2-3×. Ideal for automotive electronics requiring vibration resistance, wide temperature range operation (-40°C to 125°C), and compact design. Learn how this advanced thermal solution enables next-generation domain controllers to maintain stable performance in intelligent vehicles.
Explore the superior performance of silicone-free thermal pads in automotive thermal management. This article details how they prevent high-temperature aging, ensure dimensional adaptability for 8-inch & 14-inch screens, eliminate silicone migration, and provide stable heat dissipation from -40°C to 120°C, extending display lifespan and reducing failure rates.
Discover how ultra-thin thermal pads break the efficiency bottleneck in PVT panels by replacing traditional EVA, insulation, and encapsulation layers. With superior thermal conductivity, insulation, and durability, these 1mm pads boost combined thermal-electrical efficiency beyond 85%, reduce costs, and enable slimmer, more versatile solar applications.
Silicone‑based thermal interface materials (TIMs) have been widely used because of their compliance and thermal performance. However, under long‑term thermal cycling and high‑temperature operation they can exhibit low‑molecular‑weight silicone oil migration (commonly called "blooming"), volatilization and surface contamination that degrade electrical insulation and component reliability.
Key pain points faced by BDUs and discusses the role of silicone-free thermal interface materials in mitigating these challenges.
In today's fast-paced technological landscape, efficient heat management is more critical than ever. SheenThermal introduces the CSF 45 Carbon Fiber Thermal Pad, engineered to deliver superior performance and heightened thermal conductivity, making it an essential component for modern electronics
Selecting the correct thermal dissipation materials is critical for the performance and safety of commercial vehicle motor controllers. This comprehensive analysis details the use of flexible thermal pads for low-voltage controllers and high-performance thermal grease combined with robust insulating films for high-voltage systems. Understand how these specialized materials enhance heat transfer, prevent insulation breakdown, withstand extreme environmental conditions, and ultimately ensure operational stability and extended service life for electric commercial vehicles.
In industrial, medical, and communication applications, fiber lasers are crucial but face growing thermal challenges as power densities rise. Traditional silicone thermal materials release harmful oils and siloxanes at high temperatures, degrading optics and circuits. This drives the shift to non-silicon solutions that enhance cooling while eliminating contamination - ensuring reliable, long-term laser operation. We examine how these advanced thermal solutions address high-power laser challenges.
The innovative non-silicon thermal conductive gel is specially developed to solve the high-temperature failure problem of BDU in new energy vehicles. It has a tunable thermal conductivity of 1-10 W/m·K and can significantly reduce the interface thermal resistance to below 0.05 °C·cm²/W. The product has passed the UL94 V0 flame retardant certification and has excellent insulation performance (10¹⁴ Ω·cm), remaining stable in extreme environments ranging from -40°C to 150°C. In practical applications, it can improve heat dissipation efficiency by 25% and reduce the defect rate by 75%, making it an ideal choice for thermal management in the high-voltage systems of new energy vehicles.
In industrial production, high temperatures can cause industrial cameras to "go on strike", thereby affecting the detection efficiency. The silicon-free thermal phase-change sheet solves this problem with its 3-6W/MK thermal conductivity and low thermal resistance design. When heated, it turns into a semi-fluid state and adheres to the microscopic gaps, cools down and solidifies to maintain the adhesion, ensuring smooth heat conduction. The fully organic and silicon-free formula has zero volatility and does not contaminate optical components at 85℃, ensuring clear imaging. Test results show that after using a 20 million pixel camera, the sensor temperature remains below 55℃. The equipment in the vehicle inspection workshop operates efficiently for 12 consecutive hours, the false detection rate significantly decreases, a large amount of cost is saved annually, and the ultra-thin design is suitable for compact chassis.
This article presents boron nitride thermal conductive gaskets as a solution to drones' overheating issues. High temperatures from motors and chips hinder drones' stability, battery life, and durability. These gaskets offer 12-20W/MK thermal conductivity (3-6x better than traditional silicone), 2.2g/cm³ low density (60% lighter than metal sinks), and insulation (volume resistance over 10¹⁴Ω・cm) for safe heat transfer. Real cases show agricultural drones extended operation by 75% with 70% fewer faults, while industrial ones kept chips below 55℃ during 4-hour high-temperature work, breaking heat dissipation bottlenecks.
This article explains why silicone-free thermal pads are the ultimate solution for PDU heat dissipation challenges in data centers. Unlike traditional silicone pads that leak oil and cause oxidation, these innovative pads eliminate silicone migration while improving heat transfer by 30%. Their low-hardness design (Shore 00 30-50) ensures perfect contact with components, even in extreme temperatures (-40°C to 120°C), and provides high-voltage protection (≥5kV/mm). Discover how this breakthrough technology prevents overheating, reduces failures, and extends PDU lifespan—making it the smart choice for reliable power distribution.
Sheen Technology Co., Limited.
Address: Flat/Rm 1405A 14/F The Belgian Bank Building Nos.721-725 Nathan Road MongKok KL HK
Tel: +86 13728278261
Dongguan Sheen Electronic Technology Co., Ltd.
Tel:+86-769-22479425
E-mail:Tina: marketing@u-sheen.com
WeChat/Phone: +86 13728278261
WhatsApp: +86 13542243751
Add: Room 101, 201, 301, 401, Building 2, No. 8 Hengzhutang Road, Liaobu Town, Dongguan City, Guangdong Province ,China
