How to improve the heat dissipation capacity of LED lighting products

A:
Currently, most LED lighting products on the market use the "chip-aluminum substrate-heat sink three-layer structure" mode for heat dissipation, that is, the LED chip is soldered to the aluminum substrate board first, and then the aluminum substrate is fixed on the radiator. The heat generated by the LED chip is transmitted to the heat sink through the aluminum substrate to form an excellent heat dissipation structure. However, in this heat dissipation structure, the heat transmission speed of the aluminum substrate and the heat sink is slightly insufficient, because the two are fixed together. Later, it seemed to overlap perfectly, and in essence there were many depressions between the two that we could not see carefully with the naked eye, and these depressions were filled with air. It is generally known that the thermal conductivity of air is very low, so the air existing in the depression will become the biggest obstacle to the heat conduction of the two, which seriously affects the heat dissipation ability of LED products. Therefore, in order to improve the heat dissipation ability of the LED product, it is necessary to squeeze out the air in the depression. The method of extruding the depression air is to coat a layer of thermally conductive silicone grease at the joint between the two. This thermally conductive silicone grease can perfectly fill the depression after a cold and heat cycle, and squeeze out the air inside. It can also be used as a heat conducting medium to speed up the heat transfer between the two and increase the contact area between them, thereby improving the heat dissipation capacity of the LED products.