thermal rate and thermal conductivity

The importance of thermal conductivity:

The thermal conductivity and heat dissipation capacity of the heat dissipation device are closely related to the life and performance of the product of the electronic product. Thermal Conductivity

High thermal conductivity material or thermal conductivity interface material directly to the thermal conductivity of the higher capacity. Thermal conductivity has a variety of different titles, common thermal conductivity, heat transfer, heat transfer, thermal conductivity, thermal conductivity, thermal conductivity, thermal conductivity, heat transfer coefficient and thermal conductivity.

Key parameters of thermal interface material - Thermal conductivity:

Heat transfer coefficient (heat transfer Coefficient), also known as heat transfer coefficient (k) in W / mK, thermal conductivity formula k = (Q / t) * L / (A * T), where k is the thermal conductivity, Q is the heat, t is the time, L is the length, A is the area, T is the temperature difference; is used to measure the energy per unit time conduction.

Design of the thermal conductivity of the interface material is the key parameter of the thermal conductivity, select the best performance (high K value) products are not necessarily necessary, hardness, thickness, heat area is also an important design considerations. When the other parameters are equal, the higher the thermal conductivity represents the more efficient thermal management.

The k-value interval of the thermally conductive interface material:

Low k value: 1 - 3 W / m-k

In k value: 4 -6 W / m-k

High k value: 6 - 12 W / m-k