What are the classifications of heat dissipation materials for electronic applications?

Thermally conductive materials are generally divided into: thermally conductive silicone pads, ceramic heat sinks, graphite sheets, phase change materials, silicone cloth, etc.
Thermally conductive silicone pad: the base material is silicone, a thermally conductive material synthesized by adding various auxiliary materials and metal oxides, also known as thermally conductive silicone sheet, soft thermal pad, etc.
Thermally conductive double-sided adhesive: Acrylic base material is compounded by adding filled thermally conductive powder and organic silicone to achieve thermal conductivity and insulation.
Ceramic heat sink: The characteristics of this material are high thermal conductivity and high insulation. Generally, high-power equipment will use this thermally conductive material.
Thermally conductive silicone cloth: The base material of this material is glass fiber, and some people call it thermally conductive silicone cloth, tear-resistant silicone cloth, etc. This material has better insulation than cross, the disadvantage is that the thermal conductivity is relatively low
Thermal graphite sheet: This material is a new type of material with high performance. It can dissipate heat in two directions at the same time, so the heat dissipation ratio is uniform.
Phase change material: Phase change material is generally used in electronic devices such as liquid crystal displays. Due to the fluidity of the product when heated, the gap filling performance is also good, and it is a thermally conductive material with high cost performance.