Selection Of Thermal Conductive Materials

When it comes to heat dissipation systems, many people think of fans and fins. In fact, they have neglected a medium which is insignificant but plays an important role - heat conduction medium. Computer CPU is a typical power equipment that needs excellent heat dissipation, so let's talk about heat conduction data. I hope we can discuss and express our views on heat dissipation of various power equipment. Why do some people think that the surface of CPU or the bottom of radiator is very smooth, and there is no need for heat conduction media between them? This idea is wrong! Because it is impossible to make an ideal flat surface by mechanical processing, there are many ravines or vacancies between CPU and radiator, all of which are air.

We know that the thermal resistance of air is very high, so we must use other materials to reduce the thermal resistance, otherwise the function of the radiator will be discounted, or even unable to play a role. Therefore, thermal conductive media came into being. Its function is to fill the large and small space between the processor and the radiator, and increase the touching area between the heat source and the radiator. Thereby, heat conduction is only one function of heat conduction medium, and the most important function is the effective touch area of CPU and radiator.