Application of thermal gel in electronic equipment with high performance and miniaturization

With the global development trend of high-performance and miniaturization of electronic equipment, especially in the field of new energy vehicles and 5G applications, the requirements for electronic equipment are higher. The timely heat dissipation capability of products is particularly important in the development of electronic equipment. The main reason for the heat generation of electronic equipment is very high. Simple formula: Q=I²Rt, heat will be generated when current flows through the resistor, and power electronic components are the main heat source.

Generally speaking, the heat-dissipation system composed of heat-conducting material and heat-dissipating accessories can effectively dissipate heat. The heat-conducting material plays an auxiliary role in this process. The heat conduction efficiency in the air is low, and the inside of electronic equipment is full of various gaps. If there is no thermally conductive material filled, the heat cannot be effectively conducted to the outside, and the thermally conductive material can effectively fill the gap between the heat source and the heat sink assembly, reduce the contact thermal resistance, and improve the heat transfer efficiency.

Thermally conductive silicone sheet is a commonly used thermally conductive material. It has the characteristics of high thermal conductivity, low thermal resistance, high insulation, aging resistance, high temperature resistance, etc., but it is facing the increasingly miniaturized and multifunctional electronic equipment field In other words, the high integration of internal parts and the narrow space make the thermal conductive silicone sheet unable to play its role. Here we need to use a thermal conductive material that can customize the size and amount and also plays the role of the thermal conductive silicone sheet. This kind of thermal conductive material is called thermal conductive gel.

Thermal gel is a soft silicone thermal gap filler material with high thermal conductivity, low thermal resistance and good thixotropy. It is an ideal material for applications with large gap tolerances. It is filled between the electronic components to be cooled and the radiator/housing, etc., to make them come in close contact, reduce thermal resistance, quickly and effectively reduce the temperature of the electronic components, thereby prolonging the service life of the electronic components and improving their reliability. Thermally conductive gel has excellent self-adhesive properties, is easy to handle, can be reused, and is widely used in low pressure situations.

The advantage of Thermal gel is that it is filled with various irregular shapes according to product design requirements, and the stress is extremely low, and it can be applied to various irregular-sized components on the circuit board. By accurately controlling the application amount through the machine, the material utilization rate can be improved. .

The storage and management cost of the thermal gel is low. Generally, the thermal conductivity of the thermal gel is determined, and the capacity is enough. Unlike the thermal pad, it needs to be stored and stored according to different specifications. The thermal conductivity of thermally conductive gel will be better than that of thermally conductive silica gel. Two types of Thermal gel and thermally conductive gel with the same thermal conductivity will have better thermal conductivity.