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Dongguan Sheen electronic Technology Co., Ltd.'s SE35 thermal conductive gel is a one-component silicon-based thermal conductive gap filling gel with soft texture and non-curing. Between components, Chomerics GEL30 can be directly replaced. Many customers expressed affirmation of the thermal conductivity and reliability of SE35 after testing and small batch trial production, and are willing to use SE35 to replace Chomerics GEL30. So what are the characteristics of SE35 thermal conductive gel?
SE35 thermal conductive gel has good thermal conductivity and excellent compressive properties, which can minimize the stress on the interface of the device, or even not stress. Excellent rheological properties enable the material to be dispensed automatically under lower pressure, saving labor. In addition, the low oil yield of thermally conductive gel can replace the traditional thermal grease with high oil yield. Single-component packaging, no refrigeration and mixing are required, and the production operation is simple and convenient. High thermal conductivity gels can be stored at room temperature and do not require other specific conditions.