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  • What is the role of thermal grease in thermal conductive materials?
  • What is the role of thermal grease in thermal conductive materials?

    Date:2022-06-02 

    Most of the cooling system design is actually very simple. The main design principle is to reduce the temperature inside the device through active guidance or the influence of the external environment. Usually, a radiator is installed on the surface of the heat source, and the excess heat of the heat source is guided to the outside through the radiator, so as to reduce the temperature of the device.

    Thermal grease is one of several thermally conductive materials with a high degree of awareness. Many people, especially men, may have more contact with it. When assembling a computer, you need to apply a layer of thermal grease on the surface of the CPU, or reapply it during maintenance of the discrete graphics card. Silicone grease, then what exactly is thermal grease?

    Thermal grease is a semi-fluid paste-like thermal conductive material made of silicone oil base material, adding thermal conductivity, temperature resistance, and insulating materials in a certain proportion. It has high thermal conductivity, low interface thermal resistance, and good electrical insulation. It is generally considered to be extremely The best thermal interface thermal material, due to its stable performance, there will be no corrosive substances during operation.

    Thermal grease itself has excellent interface lubricity. It is evenly spread on the surface of power-consuming electronic components, which can eliminate the air contacting the interface. Because it is a semi-fluid paste, it can effectively fill the rough surface between the interfaces. This increases heat flow and reduces thermal resistance.

    There is a gap between the surfaces, and the thermal conductive material represented by thermal grease can effectively reduce the contact thermal resistance between the interfaces and increase the rate of heat transfer between the two, thereby truly improving the heat dissipation effect of the device.
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