What are the differences in thermal conductivity phase change sheets?

Heat in the air heat conduction effect is very poor, the space in the equipment is relatively narrow and does not flow, so that the heat can not naturally flow to the outside, so that the local temperature of the equipment increases, and affects its normal operation, people through the active heat source excess heat guide to the heat dissipation module, in order to reduce the temperature of the heat source.

Thermal interface materials is a kind of auxiliary material processing equipment heat conduction problem of heat dissipation, people rarely direct access to the thermal interface materials, but in the use of all kinds of electrical equipment with the application of thermal interface materials, equipment gap between inner heat source surface and heat dissipation module interface, heat transfer blocked and affect the cooling effect, Therefore, thermal interface materials are used to fill the space between the two to reduce the contact thermal resistance between the two, so as to improve the heat dissipation effect of the device.

Thermal conductivity of thermal conductivity phase change sheet is a kind of different from ordinary gasket type of thermal interface materials, its advantages between thermal conductive silicone piece and thermal conductive silicone, within the scope of reach a phase transition temperature, thermal conductivity phase change will soften, maximum limit joint between aperture, lower thermal resistance and temperature returned to room temperature, and will get back to the gaskets, because of its characteristics, It can greatly reduce the contact thermal resistance between the heat source and the heat dissipation module, so that heat can be quickly transferred to the heat dissipation module.

Some equipment with high requirements for heat dissipation, such as high-performance chips, large servers, high precision instruments and equipment, etc., thermal conductivity phase change chip can play its maximum role.