Brief description of thermal interface material - thermal paste

Many people may not understand why the computer CPU and the cooling fan seem to be seamless, but the heat dissipation effect is not up to the ideal requirement. Why can't the cooling fan effectively reduce the CPU temperature?

Thermal paste is a kind of thermal interface material commonly used to deal with heat conduction problems. Applying thermal paste between the heat source of the equipment and the heat dissipation device can quickly fill the interface gap, remove the air in the gap, and reduce the contact thermal resistance between the two , so that the heat can be quickly dissipated. In addition to the characteristics of high thermal conductivity and low thermal resistance, the thermal conductivity of thermal paste is better than that of thermal pads, because thermal paste can better fill the gaps in the interface, so the overall heat dissipation effect will be better.

Most of the electronic equipment and electronic products now require the use of thermal interface materials, especially in some high-speed and high-frequency products, the requirements for thermal interface materials are even higher, so thermal interface materials such as thermal paste There is also more demand. Thermal paste has the characteristics of high cost performance and good thermal conductivity. It has application cases in many fields.