Heat dissipation application case of thermal gap filler material in PCB

Electronic equipment will generate heat when it is working. The heat is not easy to conduct outside the equipment, which makes the internal temperature of the electronic equipment rise rapidly. If there is always a high temperature environment, the performance of the electronic equipment will be damaged and the service life will be reduced. Channel this excess heat outward.

When it comes to the heat dissipation treatment of electronic equipment, the key is the heat dissipation treatment system of the PCB circuit board. The PCB circuit board is the support of the electronic components and the carrier for the electrical interconnection of the electronic components. With the development of science and technology, electronic equipment is also developing toward high integration and miniaturization. It is obviously insufficient to rely solely on the surface heat dissipation of the PCB circuit board.

When designing the position of the PCB current board, the product engineer will consider a lot, such as when the air flows, it will flow to the end with less resistance, and all kinds of power consumption electronic components should avoid installing edges or corners, so as to prevent heat from being transmitted outward in time. In addition to space design, it is necessary to install cooling components for high-power electronic components.

Thermally conductive gap filling material is a more professional interface gap filling thermal conductive material. When two smooth and flat planes are in contact with each other, there are still some gaps. The air in the gap will hinder the heat conduction speed, so the thermal conductive gap filling material will be filled in the radiator. Between the heat source and the heat source, remove the air in the gap and reduce the interface contact thermal resistance, thereby increasing the speed of heat conduction to the radiator, thereby reducing the temperature of the PCB circuit board.