Principle and application of thermal conductivity pads

The thermal conductivity pads, insulating and thermal materials uses a silicon rubber base material, and ceramic particles such as boron nitride and alumina are used as fillers, and the heat conducting effect is very good.

Under the same conditions, the thermal impedance is smaller than other thermally conductive materials. It is soft, clean, non-polluting, radioactive, and highly insulating. Fiberglass reinforcement provides good mechanical properties.
The thermal conductivity of thermally conductive pad is not only related to the thickness of the thermally conductive material, but also to the area of the thermally conductive material. Due to the structural relationship of the thermally conductive material, in general, the thermally conductive material is also related to the amount of pressure. The higher the pressure, the stronger the thermal conductivity. Generally, the heat-conducting material is subjected to a pressure of 5-100psi, and the installation pressure of most radiators will not exceed 250psi.

Alumina thermal conductive pad: good thermal conductivity, beautiful appearance, widely used for heat dissipation of communications,Heat sink, Semicoductors, CPU GPU Graphics cards, LED lighting and dispaly screen, power electronics and other electronic products.
Boron nitride thermal conductive rubber: excellent thermal conductivity, suitable for high power device heat dissipation, compared with ordinary thermal conductive materials, the device temperature can be lower than 20 ℃ under the same conditions.