Fever problem with driving recorder? Thermally conductive silicon pad helps you get it

The car recorder seems to become an essential accessory for today's automobile family. In the face of today's complicated traffic conditions and the incomparable situation of masters of porcelain, 4G driving recorder has become a smart product for vehicle owners to record driving videos. Especially now many recorders are equipped with In addition to 1080P ultra-high-definition video recording, the driving recorder continuously records video during operation. The amount of data processed by the main components is very large, and the chip is in a high-speed running state, and the heat generated is also very large. If the key components are not heat-treated, the recorder will stop recording, restart, and even burn, which is the problem of the so-called fever, fever, and crashes.

In particular, many driving recorders and car recorders are hung under the front windshield and exposed to the sun. After a long time, they are "dead" and become hot when they are turned on. How to deal with the fever of the driving recorder, then the heat dissipation problem of the recorder needs to be solved in the product design scheme, and the use of thermally conductive silicone pad is the current mainstream solution. You may think that it ’s no problem for me to buy a driving recorder that is resistant to sunlight and heat. Of course, it is not that simple. The most fundamental thing is to start with the heat dissipation structure inside the driving recorder and choose a good software. Thermally conductive silicone sheet to solve the problem of heat dissipation from heat sources.



The main function of the thermally conductive silicone sheet is to conduct heat to the main components to cool down, and to cool the 4G driving recorder to ensure normal work. The cooling principle of the thermally conductive silicone sheet is to transfer the heat of the DSP main control chip and DDR2 chip of the driving recorder to the shield, and then the heat is radiated to the air and the ground layer of the motherboard for heat dissipation through the shield.