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SF1600-BN Boron Nitride Thermal Pad
Typical Applications:
SF1600-BN series: 16 W/m·K thermal conductivity, 0.2–3.0 mm thickness range, −40 to 150 °C operating temperature, UL 94 V-0 flame rating, ≥10¹² Ω·cm volume resistivity, RoHS / REACH / halogen-free compliant. Available in 8 standard thicknesses with custom die-cutting.
To request a sample of our Boron Nitride Thermal Pads or inquire about more product information, please email us at tina@u-sheen.com or request a product sample.
Product Description
◆ Exceptional thermal conductivity up to 16.0 W/mK.
◆ Available in various thicknesses from 0.2 to 3.0 mm.
◆ Excellent flame retardancy.
◆ High compressibility, flexibility, and elasticity ideal for low-pressure applications.
◆ Low thermal resistance.
◆ Customizable shapes according to client requirements.
◆ Compliant with RoHS, Halogen, REACH environmental and safety standards.
◆ Excellent flexibility, resilience, and thermal stability.
【Applications】
◆ Aerial drones
◆ Humanoid robots
◆ Photovoltaic inverters
◆ AI data centers
◆ Intelligent driving chips
◆ Communication equipment
Properties
| Boron Nitride Thermal Pad Technical Specifications | ||||||||||
|---|---|---|---|---|---|---|---|---|---|---|
| Property | Unit | SF1600-BN-02 | SF1600-BN-03 | SF1600-BN-05 | SF1600-BN-07 | SF1600-BN-10 | SF1600-BN-15 | SF1600-BN-20 | SF1600-BN-30 | Test Method |
| Color | - | White | White | White | White | White | White | White | White | Visual |
| Thermal Conductivity | W/m·K | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | ASTM D5470 |
Thermal Resistance (@40psi) | ℃*cm²/W | ≤0.25 | ≤0.3 | ≤0.5 | ≤0.7 | ≤0.8 | ≤1.1 | ≤1.4 | ≤1.7 | ASTM D5470 |
Application temperature | ℃ | -40~150 | -40~150 | -40~150 | -40~150 | -40~150 | -40~150 | -40~150 | -40~150 | - |
Thermal weight loss rate | % | ≤1 | ≤1 | ≤1 | ≤1 | ≤1 | ≤1 | ≤1 | ≤1 | - |
| Thickness | mm | 0.2 | 0.3 | 0.5 | 0.7 | 1.0 | 1.5 | 2.0 | 3.0 | ASTM D374 |
| Breakdown voltage | KV,@AC | ≥2 | ≥4 | ≥5 | ≥6 | ≥10 | ≥12 | ≥12 | ≥12 | ASTM D149 |
| Dielectric constant | F/m, @ 1MHz | ≤4.2 | ≤4.2 | ≤4.2 | ≤4.2 | ≤4.2 | ≤4.2 | ≤4.2 | ≤4.2 | ASTM D150 |
| Volume resistivity | Ω*cm, @250V | ≥10¹² | ≥10¹³ | ≥10¹³ | ≥10¹³ | ≥10¹³ | ≥10¹³ | ≥10¹³ | ≥10¹³ | ASTM D257 |
| Rebound rate | % | ≥90 | ≥90 | ≥80 | ≥70 | ≥70 | ≥60 | ≥60 | ≥60 | - |
| Density | g/cm³ | 1.6±0.2 | 1.6±0.2 | 1.6±0.2 | 1.6±0.2 | 1.6±0.2 | 1.6±0.2 | 1.6±0.2 | 1.6±0.2 | ASTM D792 |
| Hardness | shore 00 | 50~70 | 50~70 | 50~70 | 50~70 | 50~70 | 50~70 | 50~70 | 50~70 | ASTM D2240 |
| Flammability rating | - | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | UL 94 |
How to choose the thickness — For thin gaps of 0.2–0.3 mm, use SF1600-BN-02 or BN-03. For 0.5–0.7 mm, use SF1600-BN-05 to -07. For 1.0–2.0 mm on power modules, SF1600-BN-10 to -20 balances compressibility against thermal resistance. Above 2.0 mm, SF1600-BN-30 maintains contact at low clamping pressure.
【Product Specifications】
Sheet products: Customized
Die-cut products: Customized
【Storage & Transportation】
Store in a well-ventilated, cool, and dry area. Keep away from open flames.
This product is non-toxic and should be stored and transported as a non-hazardous material.
【Packaging】
Customized packaging according to customer requirements.
【Shelf Life】
12 months.
About Us
Dongguan Sheen Electronic Technology Co., Ltd.
◆ Founded: 2008
◆ Team: 200 employees
◆ Facility: 20,000㎡
◆ Core Focus: R&D and production of functional materials
◆ Strengths: Efficient, collaborative team
◆ Achievements: Key supplier to leading global manufacturers
◆ Application Fields: Telecom, Automotive, Medical, Computing, Industrial , Military
◆ Certifications: ISO9001:2015, ISO14001:2015, IATF16949:2016
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FAQ About Boron Nitride Thermal Pads
1. What is a boron nitride thermal pad?
A boron nitride thermal pad is a thermally conductive and electrically insulating thermal interface material used to transfer heat between electronic components and heat sinks. The SF1600-BN Series combines high thermal conductivity, electrical insulation, flexibility, and compressibility to help fill air gaps between heat-generating components and cooling structures.
2. What is the thermal conductivity of the SF1600-BN boron nitride thermal pad?
The SF1600-BN Series provides a thermal conductivity of 16 W/m·K. Its thermal resistance varies with pad thickness, with values ranging from ≤0.3 to ≤1.7 °C·cm²/W at 40 psi for the listed thickness grades. This makes the material suitable for applications requiring efficient heat transfer within a controlled interface thickness.
3. Does the SF1600-BN thermal pad provide electrical insulation?
Yes. The SF1600-BN Series is designed to provide both thermal conductivity and electrical insulation. Depending on thickness, the breakdown voltage ranges from ≥4 kV to ≥12 kV, while volume resistivity is ≥10¹³ Ω·cm at 250 V. This makes the material suitable for electronic applications where thermal management and dielectric insulation are required at the same interface.
4. Is the SF1600-BN thermal pad suitable for low-pressure applications?
Yes. The SF1600-BN Series has high compressibility, flexibility, and elasticity, making it suitable for low-pressure thermal interfaces. Its compliant structure helps conform to surface irregularities and fill gaps between components and heat sinks without requiring high assembly pressure.
5. What applications are SF1600-BN boron nitride thermal pads used for?
SF1600-BN boron nitride thermal pads are suitable for thermal management in aerial drones, humanoid robots, photovoltaic inverters, AI data centers, intelligent driving chips, and communication equipment. The pads are available in thicknesses from 0.2 to 5.0 mm and can be supplied as customized sheets or die-cut parts according to application requirements.
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