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GSF Series Graphene Thermal Pad
Typical Applications:
The GSF series consists of vertically oriented graphene thermal pads that combine high thermal conductivity with low thermal resistance. Utilizing graphene as the primary thermally conductive filler and employing directional alignment and lamination technologies, the product establishes vertical thermal conduction paths, thereby significantly enhancing heat transfer efficiency. It is suitable for high-power thermal management applications, such as base stations, automotive domain controllers, and high-performance computing chips. Additionally, the pad features high resilience, excellent conformability, and resistance to deformation.
To request a sample of our Graphene Thermal Pads or inquire about more product information, please email us at tina@u-sheen.com or request a product sample.
Product Description
◆ Provides excellent thermal conductivity, with a thermal conductivity coefficient of up to 75-130 W/mK.
◆ Available in various thicknesses from 0.2 to 2.0 mm.
◆ Excellent flame retardant.
◆ Low thermal resistance 0.06-0.11 ℃*cm²/W, @40psi.
◆ Customizable shapes per client requirements.
◆ Compliant with RoHS, Halogen-free, REACH environmental and safety standards.
◆ Excellent flexibility, resilience, and thermal stability.
【Applications】
◆ Semiconductor testing
◆ AI chips
◆ Intelligent driving chips
◆ Optical modules
◆ Communication equipment
◆ Drones
◆ Humanoid robots
Properties
| Graphene Thermal Pad Technical Specifications | |||||||
|---|---|---|---|---|---|---|---|
| Performance | Properties | GSF75-020 | GSF75-030 | GSF90-030 | GSF110-030 | GSF130-030 | Test Method |
| Thermal Properties | Thermal Conductivity（W/m·K） | 75 | 75 | 90 | 110 | 130 | ASTM E1461 |
| Thermal Resistance (℃*cm²/W, @40psi) | ≤0.11 | ≤0.12 | ≤0.10 | ≤0.08 | ≤0.06 | ASTM D5470 | |
| Application Temperature（℃） | -40~150 | -40~150 | -40~150 | -40~150 | -40~150 | / | |
| Physical Properties | Rebound Rate（%） | ≥90 | ≥90 | ≥90 | ≥90 | ≥90 | / |
| Tensile Strength（Mpa） | ≥0.03 | ≥0.03 | ≥0.05 | ≥0.05 | ≥0.05 | ASTM D412 | |
| Color | Black | Black | Black | Black | Black | Visual | |
| Thickness（mm） | 0.2~2.0 | 0.2~2.0 | 0.2~2.0 | 0.2~2.0 | 0.2~2.0 | ASTM D374 | |
| Density（g/cm³） | 0.3~0.7 | 0.3~0.7 | 0.3~0.7 | 0.3~0.7 | 0.3~0.7 | ASTM D792 | |
| Oil Bleeding Rate（%） | ≤3 | ≤3 | ≤3 | ≤3 | ≤3 | / | |
| Flame Retardancy | Flame rating | V-0 | V-0 | V-0 | V-0 | V-0 | UL 94 |
【Storage & Transportation】
Storage temperature: ≤30°C
Storage humidity: ≤75%
【Packaging】
Customized packaging according to customer requirements.
About Us
Dongguan Sheen Electronic Technology Co., Ltd.
◆ Founded: 2008
◆ Team: 200 employees
◆ Facility: 20,000㎡
◆ Focus: R&D and production of functional materials
◆ Strengths: Efficient, collaborative team
◆ Achievements: Key supplier to leading global manufacturers
◆ Applications: Telecom, Automotive, Medical, Computing, Industrial , Military
◆ Certifications: ISO9001:2015, ISO14001:2015, IATF16949:2016
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FAQ About Graphene Thermal Pads
1. What is a graphene thermal pad?
A graphene thermal pad is a thermal interface material that uses graphene as a thermally conductive filler to transfer heat between heat-generating components and cooling structures. The GSF Series uses directional alignment and lamination technologies to create vertically oriented graphene thermal conduction paths, providing high thermal conductivity and low thermal resistance in a flexible pad format.
2. What is the thermal conductivity of the GSF Series graphene thermal pad?
The GSF Series offers thermal conductivity from 75 to 110 W/m·K. Available grades include GSF75, GSF90, and GSF110, with the GSF110-03 grade reaching 110 W/m·K. Thermal resistance ranges from ≤0.08 to ≤0.12 °C·cm²/W at 40 psi, depending on the product grade and thickness.
3. What is a vertically oriented graphene thermal pad, and why is it used?
A vertically oriented graphene thermal pad is designed so that the graphene-based thermal conduction paths are preferentially aligned in the through-thickness direction. This structure helps guide heat from the heat source toward the heat sink more efficiently, making the GSF Series suitable for applications where through-plane heat transfer and low thermal resistance are critical.
4. What applications are GSF Series graphene thermal pads used for?
GSF Series graphene thermal pads are designed for high-power thermal management applications, including semiconductor testing, AI chips, intelligent driving chips, optical modules, communication equipment, drones, and humanoid robots. Their high thermal conductivity, low thermal resistance, flexibility, and resilience make them suitable for demanding electronic and computing applications.
5. Can GSF Series graphene thermal pads be customized?
Yes. GSF Series graphene thermal pads can be customized according to application requirements. Standard thicknesses range from 0.2 to 2.0 mm, and customized shapes are available for different component geometries and assembly configurations. Customized packaging is also available according to customer requirements.
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