Heat dissipation principle of electronic equipment

Today, integrated circuits are commonly used in electronic product parts, and it is particularly urgent to solve the large amount of heat generated by the chip due to integration. Everyone knows that high temperature is the natural enemy of electronic products. It will not only cause unstable performance of electronic products and greatly reduce the service life. Portable electronic products may even cause harm to human bodies due to high temperatures. Therefore, our electronic product structural design engineers need to optimize the structural design, and then choose a thermally conductive interface material with good thermal conductivity to help the chip quickly and effectively conduct a large amount of heat to ensure that the electronic product can be in a safe temperature range. Stable operation.

The cooling method can be divided into passive cooling and active cooling.
Active cooling: Promote fluid circulation by external force, taking away heat.
Passive heat dissipation: It is based on the principle of thermal expansion and contraction of physics. The fluid is naturally circulated to dissipate heat or the specific heat capacity of a solid fluid is used to absorb heat to achieve the purpose of heat dissipation.
The heat dissipation method can be subdivided into heat conduction, heat convection and heat radiation
Heat conduction: The heat transfer when there is no macroscopic movement in the medium. The heat is transferred from one part of the system to another or from one system to another. It can occur in solid, liquid and gas.
Thermal convection: refers to the relative displacement (convection) between various parts of the fluid caused by the macroscopic movement of the fluid, and the heat transfer process caused by the mixing of cold and hot fluids. Convective heat transfer can be divided into forced convection and natural convection. Forced convection is the circulation of fluid caused by external forces. Natural convection is caused by temperature gradients with different density. Gravity causes low temperature and high density fluids to flow from top to bottom, and high temperature and low density fluids to flow from bottom to top.
Thermal radiation: It is a kind of heat transfer method that uses the form of electromagnetic radiation to radiate thermal energy outward. It works independently of any external conditions.

The principles of thermal design
1, reduce heat
Choose better control methods and technologies, such as phase-shift control technology and synchronous rectification technology, and select low-power devices to reduce the number of heating devices, increase the width of thick printed lines, and improve the efficiency of the power supply.

2, strengthen heat dissipation
That is, heat is transferred using conduction, radiation, and convection technologies. But for products with a flat appearance, first of all, it is not possible to use more aluminum heat sinks and fans from the space. On the whole, it is not allowed to strengthen the cold cooling design. Convection cannot be used. The same way of radiating heat is difficult to achieve in flat spaces.

The future development direction of security products. The image processing capability will become higher and higher, and the pixels will become denser. The mainstream camera 720P is gradually moving towards high-end, high-definition pixels, 1080P, 4K image quality, etc., and the demand for thermal interface materials will also Increase to 6W-15W; gradually develop towards cloud intelligence.

Sheen silicone thermal pad has a thermal conductivity of 1.0-10W and a thickness of 0.15-1.0mm, which meets the heat dissipation requirements of surveillance cameras of various sizes of power security equipment.