• Products
  • >
  • Thermal Gel
  • >
  • SE300AB Thermal Gel 3.0W/mK
  • Heat transfer gel Heat transfer gel
    Heat transfer gel Heat transfer gel
    Heat transfer gel Heat transfer gel
    Heat transfer gel Heat transfer gel

    SE300AB Thermal Gel 3.0W/mK

    Use Range:
    SE300AB is a soft silicone-based thermally conductive gap-filling material with high thermal conductivity, low interfacial thermal resistance and good thixotropy. It is an ideal material for applications with large gap tolerances. It is filled between the electronic components to be cooled and the heat sink/housing, etc., making them in close contact, reducing thermal resistance, and quickly and effectively reducing the temperature of the electronic components, thereby extending the life of the electronic components and improving their reliability. The SE300AB can be applied by hand or by dispensing equipment.

    Free Samples
    To request a sample of our two-component (2K) Thermal Gel (Thermal Liquid Gap Filler) or inquire about more product information, please email us at [email protected] or Click here.
     

    Product Description

    The SHEEN's SE Series two-component Thermal Gel are renowned for their distinctive characteristics, which include:  
    ◆ Good thermal conductivity, available in options ranging from 2.0 to 8.0 W/m·K.  
    ◆ Soft and elastic after curing, maintaining the required thickness and providing shock absorption.  
    ◆ High electrical insulation, with dielectric strength up to 8 kV/mm.  
    ◆ Excellent flame resistance, achieving a UL94 V-0 rating.  
    ◆ Curing time adjustable based on temperature.  
    ◆ Two-component structure for easy storage.  
    ◆ Can be precisely controlled for thickness and shape using automated equipment.  
    ◆ Complies with RoHS, Halogen-Free, and REACH environmental and safety standards.  
     

    【Applications】

    ◆ CPUs and GPUs  
    ◆ Power Supply Units (PSUs)  
    ◆ LED Modules  
    ◆ Engine Control Units (ECUs)  
    ◆ Gaming Consoles and Laptops  
     

    Properties

    Properties Unit SE300AB Test Method
    Thermal Conductivity W/m·K 3.0 ASTM D5470
    Flow Rate(@50cc,90psi) g/min 20±5 -
    Color Before Curing - Part A: White
    Part B: Pink
    Visual
    Density g/cc 3.0 Helium Pycnometry
    Mix Ratio - 1:1 -
    Color After Curing - Pink Visual
    Hardness After Curing Shore 00 55±10 ASTM D2240
    Tack-Free Time (@25℃) min 30 -
    Full Cure Time (@25℃) h 1 -
    Full Cure Time (@100℃) min 5 -
    Minimum Interface Thickness mm 0.10 -
    Shelf Life (@25℃) months 6 -
    Operating Temp. -50 ~ 150 -
    Dielectric Strength (@AC) kV/mm > 8 ASTM D149
    Dielectric Constant (@1MHz) - 6.5 ASTM D150
    Volume Resistivity Ω·cm >1013 ASTM D257
    Coefficient of Thermal Expansion ppm/K 175 ASTM E831
    Flame Rating - V-0 UL94
    RoHS - PASS IEC 62321
    Halogen - PASS EN 14582
    REACH - PASS EN 14372
     

    About Us

    Dongguan Sheen Electronic Technology Co., Ltd.
    Founded: 2008
    Team: 110 employees
    Facility: 5,000㎡
    Focus: R&D and production of functional materials
    Strengths: Efficient, collaborative team
    Achievements: Key supplier to leading global manufacturers
    Applications: Telecom, Automotive, Medical, Computing, Industrial , Military
    Certifications: ISO9001:2015, ISO14001:2015, IATF16949:2016

     

    Partners

    Certifications

     

    Videos

    INQUIRY

    Follow us : facebook Twitter Linkedin Pinterest GooglePlus
    top