Product Description
3611B-09 Patch SMT red glue is a one-component,high-temperature, fast-curing epoxy adhesive. It is used for bonding SMD components on printed circuit boards.Safe to use and meet environmental requirements.
I. Material characteristics before curing | ||
Item | Parameter | Test method |
Colour | Red | Visually |
Yield value (25 ° C, Pa) | 620 | *** |
Specific gravity (25 ° C, g / cm3) | 1.36 ± 0.2 | *** |
Viscosity (25 ° C, cps) | 550,000 ± 10% | *** |
Thixotropic index | 6.5 ~ 7.5 | *** |
Flash point (TCC) | > 95 ℃ | *** |
Particle size | <15um | *** |
Copper mirror corrosion | No corrosion | Visually |
Use method & precautions
1. The 3611B-09 stored in the store needs to be warmed before use. Under the environment of 25 ° C, the normal temperature of 30ml is 2-4 hours, and the temperature of 200-300ml is 4-6 hours.
Precautions:
(1) To avoid contamination of unused glue, do not return any glue to the original packaging.
(2) Glue solution is barely placed in the air, it will absorb trace moisture and affect performance, so it should be avoided as much as possible. When printing on stencils, please do not leave the printed circuit board in the air for too long. It should be cured as soon as possible. If necessary, the humidity of the air should be controlled.
(3) If in a non-standard conventional environment: 25 ° C, please completely thaw according to the specific environment. Do not quickly thaw the glue by heating.
Precautions:
(1) To avoid contamination of unused glue, do not return any glue to the original packaging.
(2) Glue solution is barely placed in the air, it will absorb trace moisture and affect performance, so it should be avoided as much as possible. When printing on stencils, please do not leave the printed circuit board in the air for too long. It should be cured as soon as possible. If necessary, the humidity of the air should be controlled.
(3) If in a non-standard conventional environment: 25 ° C, please completely thaw according to the specific environment. Do not quickly thaw the glue by heating.
Curing condition test
The saved curing curve is shown below:
The suitable curing conditions are generally heating at 150 ° C for 90-120 seconds. The relationship between curing speed and final bonding strength and curing temperature and time is shown below.:
In the actual production process, the entire heating time is longer than the figure, because there is a preheating time.
The suitable curing conditions are generally heating at 150 ° C for 90-120 seconds. The relationship between curing speed and final bonding strength and curing temperature and time is shown below.:
In the actual production process, the entire heating time is longer than the figure, because there is a preheating time.
Performance & characteristics
Item | Parameter | Test method |
Density (25°C, g / cm3) | 1.36±0.1 |
Visually |
Coefficient of thermal expansion (um / m / ℃) | a1 : < Tg 50 | ASTM E831-86 |
Thermal conductivity W.M-1.K-1 | a2 : > Tg 160 | ASTM C177 |
Specific heat KJ.Kg-1.K-1 | 0.25 |
*** |
Glass transition temperature (℃) | 105-110 |
*** |
Dielectric constant | 112 |
*** |
Dielectric tangent | 3.8(100KHz) | *** |
Volume resistivity | 2.1*1015Ω.CM | ASTM D257 |
Surface resistivity | 2.1*1015Ω. CM | ASTM D257 |
Electrochemical corrosion | AN-1.2 | DIN 53489 |
Shear strength (spraying low carbon steel sheet) N / mm | 26 | ASTMD1002 |
Pull-out strength N (C-1206, FR4 bare circuit board) | 63 | |
Torque strength N.mm (C-1206, FR4 bare circuit board) | 51 |
Properties & Characteristics
Test method: ISO 4587 / ASTM D1002 shear strength
Test material: GBMS shear test piece
Curing method: curing at 150 ℃ for 30 minutes
Test material: GBMS shear test piece
Curing method: curing at 150 ℃ for 30 minutes
Solid chemical resistance / solvent performance
Heat-resistant Solder Impregnation
【Storage & transportation】Store in a cool and dry place at a temperature of 2-8 ° C for 6 months.
【Package】 Customized packaging according to customer needs
【Valid period】 This product is valid for 6 months
【Safety】 Please refer to our 《Material Safety Performance Data》(MSDS)