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Product Description
3611B-09 Patch SMT Red Glue is a one-component, high-temperature, fast-curing epoxy adhesive. It is designed for bonding SMD components on printed circuit boards. It is safe to use and complies with environmental standards.
| I. Material characteristics before curing | ||
| Item | Parameter | Test method |
| Colour | Red | Visually |
| Yield value (25 ° C, Pa) | 620 | *** |
| Specific gravity (25 ° C, g / cm³) | 1.36 ± 0.2 | *** |
| Viscosity (25 ° C, cps) | 550,000 ± 10% | *** |
| Thixotropic index | 6.5 ~ 7.5 | *** |
| Flash point (TCC) | > 95 ℃ | *** |
| Particle size | <15um | *** |
| Copper mirror corrosion | No corrosion | Visually |
Use method & precautions
1. 3611B-09 Patch SMT Red Glue stored in inventory must be brought to room temperature before use. At 25 °C, the recommended room-temperature equilibration time is 2–4 hours for 30 ml containers, and 4–6 hours for 200–300 ml containers.
Precautions:
(1) To prevent contamination of unused material, do not return any dispensed glue to the original container.
(2) The adhesive will absorb trace moisture when exposed to air, which may degrade performance. Minimize air exposure: after stencil printing, do not leave the PCB exposed to air for extended periods and cure it promptly. If required, control ambient humidity levels.
(3) In environments deviating from the standard 25 °C condition, allow the adhesive to equilibrate fully according to the ambient conditions. Do not accelerate warming via external heating.
Precautions:
(1) To prevent contamination of unused material, do not return any dispensed glue to the original container.
(2) The adhesive will absorb trace moisture when exposed to air, which may degrade performance. Minimize air exposure: after stencil printing, do not leave the PCB exposed to air for extended periods and cure it promptly. If required, control ambient humidity levels.
(3) In environments deviating from the standard 25 °C condition, allow the adhesive to equilibrate fully according to the ambient conditions. Do not accelerate warming via external heating.
Curing condition test
The archived curing curve is shown below:
The recommended curing conditions are generally heating at 150 °C for 90–120 seconds. The relationship between curing speed, final bonding strength, curing temperature and time is shown below:
In actual production, the total heating duration is longer than the time indicated in the curing curve, as production ovens include a preheating phase to gradually raise the temperature of the PCB and adhesive.
The recommended curing conditions are generally heating at 150 °C for 90–120 seconds. The relationship between curing speed, final bonding strength, curing temperature and time is shown below:
In actual production, the total heating duration is longer than the time indicated in the curing curve, as production ovens include a preheating phase to gradually raise the temperature of the PCB and adhesive.
Performance & characteristics
| Item | Parameter | Test method |
| Density (25°C, g / cm³) | 1.36±0.1 |
Visually |
| Coefficient of thermal expansion (um / m / ℃) | a1 : < Tg 50 | ASTM E831-86 |
| Thermal conductivity W.M-1.K-1 | a2 : > Tg 160 | ASTM C177 |
| Specific heat KJ.Kg-1.K-1 | 0.25 |
*** |
| Glass transition temperature (℃) | 105-110 |
*** |
| Dielectric constant | 112 |
*** |
| Dielectric tangent | 3.8（100KHz） | *** |
| Volume resistivity | 2.1*1015Ω.CM | ASTM D257 |
| Surface resistivity | 2.1*1015Ω. CM | ASTM D257 |
| Electrochemical corrosion | AN-1.2 | DIN 53489 |
| Shear strength (spraying low carbon steel sheet) N / mm | 26 | ASTMD1002 |
| Pull-out strength N (C-1206, FR4 bare circuit board) | 63 | |
| Torque strength N.mm (C-1206, FR4 bare circuit board) | 51 |
Properties & Characteristics
Test Method: Shear Strength per ISO 4587 / ASTM D1002
Test Specimen: Galvanized Bright Mild Steel (GBMS) shear test coupons
Curing Conditions: Cured at 150 °C for 30 minutes
Test Specimen: Galvanized Bright Mild Steel (GBMS) shear test coupons
Curing Conditions: Cured at 150 °C for 30 minutes
Solid chemical resistance / solvent performance
| 3611B-09 Patch SMT Red Glue: Aging Test Results (Initial Strength Retention Rate,Test at 22℃) |
||||
| Aging Condition | Temperature | Initial Strength Retention(%) | ||
| 100hr | 500hr | 1000hr | ||
| Air | 22 | 100 | 100 | 100 |
| Air | 150 | 95 | 95 | 93 |
| 98% Relative | 40 | 88 | 76 | 74 |
| Terpene Exposure | 22 | 100 | 100 | 100 |
Hot Solder Dip Test Compliance
【Storage & transportation】Store in a cool, dry environment at 2–8 °C. Shelf life: 6 months from date of manufacture.
【Package】 Packaging solutions can be customized per customer requirements.
【Valid period】 6 months from date of manufacture.
【Safety】 For detailed safety guidelines, please refer to our Material Safety Data Sheet (MSDS).
