SMT Red Glue

3611B-09 Patch SMT Red Glue is a one-component, high-temperature, fast-curing epoxy adhesive. It is designed for bonding SMD components on printed circuit boards. It is safe to use and complies with environmental standards.

 

I. Material characteristics before curing
Item	Parameter	Test method
Colour	Red	Visually
Yield value (25 ° C, Pa)	620	***
Specific gravity (25 ° C, g / cm³)	1.36 ± 0.2	***
Viscosity (25 ° C, cps)	550,000 ± 10%	***
Thixotropic index	6.5 ~ 7.5	***
Flash point (TCC)	> 95 ℃	***
Particle size	<15um	***
Copper mirror corrosion	No corrosion	Visually

1. 3611B-09 Patch SMT Red Glue stored in inventory must be brought to room temperature before use. At 25 °C, the recommended room-temperature equilibration time is 2–4 hours for 30 ml containers, and 4–6 hours for 200–300 ml containers.
Precautions:
(1) To prevent contamination of unused material, do not return any dispensed glue to the original container.
(2) The adhesive will absorb trace moisture when exposed to air, which may degrade performance. Minimize air exposure: after stencil printing, do not leave the PCB exposed to air for extended periods and cure it promptly. If required, control ambient humidity levels.
(3) In environments deviating from the standard 25 °C condition, allow the adhesive to equilibrate fully according to the ambient conditions. Do not accelerate warming via external heating.

  

The archived curing curve is shown below:


The recommended curing conditions are generally heating at 150 °C for 90–120 seconds. The relationship between curing speed, final bonding strength, curing temperature and time is shown below:

In actual production, the total heating duration is longer than the time indicated in the curing curve, as production ovens include a preheating phase to gradually raise the temperature of the PCB and adhesive.

Item	Parameter	Test method
Density (25°C, g / cm³)	1.36±0.1	Visually
Coefficient of thermal expansion (um / m / ℃)	a1 :  < Tg 50	ASTM E831-86
Thermal conductivity W.M-1.K-1	a2 :  > Tg 160	ASTM C177
Specific heat KJ.Kg-1.K-1	0.25	***
Glass transition temperature (℃)	105-110	***
Dielectric constant	112	***
Dielectric tangent	3.8（100KHz）	***
Volume resistivity	2.1*1015Ω.CM	ASTM D257
Surface resistivity	2.1*1015Ω. CM	ASTM D257
Electrochemical corrosion	AN-1.2	DIN 53489
Shear strength (spraying low carbon steel sheet) N / mm	26	ASTMD1002
Pull-out strength N (C-1206, FR4 bare circuit board)	63
Torque strength N.mm (C-1206, FR4 bare circuit board)	51