To request a sample of our two-component (2K) Thermal Gel (Thermal Liquid Gap Filler) or inquire about more product information, please email us at [email protected] or Click here.
◆ Power Supply Units (PSUs)
◆ LED Modules
◆ Engine Control Units (ECUs)
◆ Gaming Consoles and Laptops
Dongguan Sheen Electronic Technology Co., Ltd.
◆ Founded: 2008
◆ Team: 110 employees
◆ Facility: 5,000㎡
◆ Focus: R&D and production of functional materials
◆ Strengths: Efficient, collaborative team
◆ Achievements: Key supplier to leading global manufacturers
◆ Applications: Telecom, Automotive, Medical, Computing, Industrial , Military
◆ Certifications: ISO9001:2015, ISO14001:2015, IATF16949:2016
Product Description
The SHEEN's SE Series two-component Thermal Gel are renowned for their distinctive characteristics, which include:
◆ Good thermal conductivity, available in options ranging from 2.0 to 8.0 W/m·K.
◆ Soft and elastic after curing, maintaining the required thickness and providing shock absorption.
◆ High electrical insulation, with dielectric strength up to 8 kV/mm.
◆ Excellent flame resistance, achieving a UL94 V-0 rating.
◆ Curing time adjustable based on temperature.
◆ Two-component structure for easy storage.
◆ Can be precisely controlled for thickness and shape using automated equipment.
◆ Complies with RoHS, Halogen-Free, and REACH environmental and safety standards.
◆ Good thermal conductivity, available in options ranging from 2.0 to 8.0 W/m·K.
◆ Soft and elastic after curing, maintaining the required thickness and providing shock absorption.
◆ High electrical insulation, with dielectric strength up to 8 kV/mm.
◆ Excellent flame resistance, achieving a UL94 V-0 rating.
◆ Curing time adjustable based on temperature.
◆ Two-component structure for easy storage.
◆ Can be precisely controlled for thickness and shape using automated equipment.
◆ Complies with RoHS, Halogen-Free, and REACH environmental and safety standards.
【Applications】
◆ CPUs and GPUs◆ Power Supply Units (PSUs)
◆ LED Modules
◆ Engine Control Units (ECUs)
◆ Gaming Consoles and Laptops
Properties
Properties | Thermal Conductivity | Flow Rate(@50cc,90psi) | Mix Ratio | Hardness After Curing | Full Cure Time (@25℃) |
---|---|---|---|---|---|
Unit | W/m·K | g/min | Shore 00 | h | |
SE200AB | 2.0 | 50±5 | 1:1 | 55±10 | 1 |
SE300AB | 3.0 | 20±5 | 1:1 | 55±10 | 1 |
SE400AB | 4.0 | 30±5 | 1:1 | 55±10 | 1 |
SE500AB | 5.0 | 15±5 | 1:1 | 55±10 | 1 |
SE800AB | 8.0 | 10±5 | 1:1 | 40±10 | 1 |
Test Method | ASTM D5470 | - | - | ASTM D2240 | - |
About Us
◆ Founded: 2008
◆ Team: 110 employees
◆ Facility: 5,000㎡
◆ Focus: R&D and production of functional materials
◆ Strengths: Efficient, collaborative team
◆ Achievements: Key supplier to leading global manufacturers
◆ Applications: Telecom, Automotive, Medical, Computing, Industrial , Military
◆ Certifications: ISO9001:2015, ISO14001:2015, IATF16949:2016