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  • Application of thermal gel

    Date:2020-01-15 

    Thermal gels are widely used in LEDs, microprocessors, memory modules, cache memories, sealed integrated chips, DC / DC converters, IGBTs and other power modules, power semiconductors, solid-state relays, and bridge rectifiers.

    The Thermal gel has a certain degree of adhesion and will not dry out. It can be attached to a higher temperature device in a power supply or power device to transfer heat. One typical application is the application in the driving power of LED bulbs. In the export of LED lights, in order to obtain UL certification, manufacturers mostly use two-component potting glue for potting. Lamps exported to the United States require a 50,000-hour warranty. At present, the quality of LED lamp beads is not a problem. The main fault is the power supply. The power supply after potting with potting glue cannot be removed, and it can only be repaired. The lamp is discarded and replaced. If the power supply is partially filled with Thermal gel, heat can be efficiently exported, and if there is a problem with the power supply, the power supply can be easily replaced, which saves costs for the enterprise. Of course for lamps that require waterproofing. Because the heat-conducting mud can not fill all the gaps and gaps like potting glue, it can not be waterproof and moisture-proof, it is still necessary to choose potting glue.

    Another typical application is in the LED fluorescent tube. For the design of the power supply at both ends, in order not to occupy the size of the tube too much, the space at the two ends of the power supply is relatively small, and the power of the 1.2 m LED fluorescent lamp is usually designed 18w to 20w, so the heat generated by the drive power becomes larger. Thermal gel can be filled into the gaps of the power supply, especially attached to the power device to help dissipate heat and extend the life of the lamp. For some sealed module power supplies, local filling can be done with Thermal gel to achieve the effect of heat conduction.
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