Which thermal conductivity material is the best choice for 5G communication module?

  With the continuous development of communication technology, the power is changed from the previous 2G ---- 3G ---- 4G. Even in the 5G market that is about to be commercialized now, Sheen has been quietly researching and developing higher performance thermally conductive products to meet the heat dissipation requirements of 5G communication products. It is reported that China is expected to achieve pre-commercialization of 5G networks in 2019 and large-scale formal commercialization of 5G in 2020. The approach of 5G commercial use is the "carnival" of the entire industry chain. Sheen thermal material manufacturers are also actively pursuing the beach.

      "4G changes life, 5G changes society." It is understood that in theory, 5G networks can be 10-100 times faster than current 4G mobile phone network speeds, reaching peak rates of 10Gb / s or even 20Gb / s, 100 billion links, and 1 millisecond delay. Of course, 5G is not only an evolution of communication technology, but also a cross-industry revolution. While creating huge economic benefits and industrial opportunities, the entire industry chain is also facing corresponding challenges. The development of consumer electronics is increasingly lean, thin, high speed, multifunctional compatible and high reliability and stability, which will inevitably bring the challenge of heat dissipation in a limited space. Overheating the chip will reduce the frequency of the machine or even sway the machine. Thermal management issues need to be completed by heat sinks. How to solve the problem of chip heating is also the focus of the industry? Sheen has prepared the following plans for this:

      First, the super high thermal conductivity silicone thermal pad  SF800, the thermal conductivity is as high as 8.0W / m * k. At the same time, the hardness is very soft. At the same time as satisfying the customer's ultra-high thermal conductivity, with excellent compression performance, ultra-low thermal resistance greatly improves the thermal conductivity of the material. Enables the heat generated by 5G communication products to run at high speeds to be conducted through the SF800 thermally conductive silicone sheet as soon as possible.

      Second, low stress thermal gel SE50, thermal conductivity above 5.0W / m * K. Low compressive stress can be infinitely compressed. The thinnest can be compressed to 0.09mm. It will never be cured or matured. Within the operating temperature range, the hotter the product, the wetter the surface. Maximize the contact area with the interface, so that the heat generated by the 5G products can be transmitted through the material in time, so that the 5G chip in the enclosed space will not cause product crashes and card problems due to heat accumulation. Very suitable for automated equipment dispensing construction, greatly improving the efficiency of production.
      While you are still looking for various thermally conductive materials for 5G communication products, Sheen has already prepared the corresponding thermal solution for you. At the same time, please feel free to contact  Sheen, looking forward to providing you with a full range of services 24 hours, the consultation hotline: +86 0769 22479425.