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Thermally gel is a soft silicone thermal gap filler material with high thermal conductivity, low interface thermal resistance and good thixotropy. It is an ideal material for applications with large gap tolerances. It is filled between the electronic components to be cooled and the radiator/housing, etc., to make them come in close contact, reduce thermal resistance, and quickly and effectively reduce the temperature of the electronic components, thereby prolonging the service life of the electronic components and improving their reliability. Thermally conductive gel has excellent self-adhesive properties, is easy to handle, can be reused, and is widely used in low pressure situations.
Thermally gel can be automatically produced by manual dispensing or automatic dispensing machine, and the advantage of thermally conductive gel is that it is filled with various irregular shapes according to product design requirements, and the stress is extremely low, and it can be applied to various irregularities on circuit boards. The size of the components can be accurately controlled by the machine to improve the material utilization rate.