Application prospects of silicon-free thermal pads

Silicon-free thermal pad is a soft high-performance thermal gap filling material without silicon atoms. It has high thermal conductivity, low thermal resistance, high compressibility, and controllable rigidity. It is free of siloxane in the operating environment under pressure and heat. The volatilization of small molecules prevents the volatilization of small siloxane molecules from being adsorbed on the PCB board, which indirectly affects the performance of the body. The Silicon-free thermal pad acts on the gap between the heat source and the radiator/shell. Due to its good softness, it can effectively remove the air from the interface, reduce the thermal resistance of the interface and improve the thermal conductivity.

With the development of science and technology, electronic products and high-tech products are becoming more efficient and multifunctional. At the same time, there are more requirements for product reliability, especially for medical equipment, industrial cameras, new energy vehicles, automated sensors, etc. It is very high, and there can be no pollution or penetration to affect the performance of the parts, so the silicon-free thermal conductive sheet without the precipitation of small siloxane molecules has become the thermal media material of choice.

The rise of Silicon-free thermal pad did not explode in a short time, but its performance and characteristics were recognized by people. With the development of society, it is believed that the prospect of silicon-free thermal conductive sheet will be broader.