What is the difference between thermal phase change film and thermal conductive silicone pad?

Thermally conductive phase change film is a new thermally conductive filler material in recent years, and its unique advantages have made it loved by some industries. Then, compared with heat-dissipating silicone film, what is the difference between thermally conductive phase change film?

Thermally conductive phase change film is a heat-enhancing polymer. It is a solid sheet at room temperature, and becomes fluid after the phase change temperature. It has excellent lubricity and compressibility. It can be cut to any size according to customer needs and attached to the radiator. Fill the gap between the heat source and the heat sink between the power dissipation element and the power dissipation element.

The main feature of the thermal phase change film is its excellent thermal conductivity. The heat-dissipating silicone sheet and thermal paste with the same thermal conductivity have better thermal conductivity, mainly because there is a gap between the heat source and the radiator, although the heat-dissipating silicone sheet can be effective It fills the gap, but the gap is not as good as thermal paste, so when using thermal paste, the contact thermal resistance is lower. Similarly, the thermal phase change film will become soft when it reaches the phase change temperature, forming a paste similar to thermal paste. Quickly fill the gaps of the gaps, and remove the air in the gaps, reduce the thermal resistance, so the heat conduction effect is better.

Thermal resistance is one of the factors that affect the thermal conductivity of thermally conductive fillers. The greater the thermal resistance, the greater the resistance to heat in the thermally conductive filler, and the lower the thermal conductivity. In addition to thermal resistance, other thermally conductive fillers have the same parameters. , The thermal conductive material with low thermal resistance has better thermal conductivity, and the selling point of thermal phase change film is its low thermal resistance. It has characteristics similar to thermal pads and thermal paste, which can make the heat sink and power components close to a large extent. Contact to improve the efficiency of heat transfer.