Non-silicone thermally conductive pad is a kind of soft silicone oil-free thermal gap filling material, with high thermal conductivity, low thermal resistance, high compressibility, controllable hardness, no siloxane small molecules in the operating environment under pressure and heat Volatilization, to avoid adsorption of small siloxane molecules on the PCB due to the volatilization of siloxane molecules, which indirectly affects the performance of the body. The non-silicone oil heat-conducting gasket acts on the gap between the heat source and the radiator/shell. Due to its good softness, it can effectively remove the air at the interface, reduce the interface thermal resistance, and improve the heat conduction effect.
Non-silicone thermally conductive pad will not precipitate small siloxane molecules during the use process, but it does not mean that they will not produce oil. The main production process of Non-silicone thermally conductive pad is to use special grease and thermally conductive, heat-resistant, and insulating materials in a certain proportion Mixing, refining by machine, the finished product will have some small molecules that are free and not completely mixed. In a long-term heated and compressed environment, small molecules will still be precipitated, but they are not silicon. Oxyane is small molecule, so it will not cause adverse effects on the equipment.