Non-silicone thermally conductive pad is a gap-filled thermally conductive gasket with a special resin as the base material. It has high resilience, high flexibility, high thermal conductivity, low thermal resistance, etc., and it is under continuous pressure and heat. There is no small siloxane molecule precipitation under the condition of avoiding the precipitation of small siloxane molecules in thermal conductive products containing silicone oil under long-term working conditions, which will cause the performance of electronic components to decrease and extend their working life.
The AF series of Non-silicone thermally conductive pad produced by our company have a thermal conductivity of up to 8W, and have passed 1000 hours of reliability testing. They have low thermal resistance and reliable quality. Although the thermal conductivity is a parameter to measure the thermal conductivity of materials, we must also pay attention to its thermal resistance. , Thermal resistance is the temperature difference formed between the two ends of the object when the heat flow passes through the object. The lower the thermal resistance, the better the thermal conductivity of the Non-silicone thermally conductive pad.