5W/mk thermal paste SG560-50

The above is the application of thermal conductive materials in the field of computer assembly, and also explains why a thermal conductive medium should be filled between the radiator and the heat source. There are many kinds of thermal conductive materials, in addition to thermal paste, thermally conductive silicone sheet, thermally conductive phase change film, thermally conductive silicone cloth, thermally conductive gel, silicon-free thermally conductive gasket, carbon fiber thermally conductive pad, etc.

Thermally conductive paste is a kind of semi-flowing paste-like thermally conductive gap filling material, and it is also one of the most widely used thermally conductive materials on the market. It is a semi-flowing paste-like compound with silicone resin as the base material. It has high thermal conductivity, low thermal resistance, and excellent lubrication performance. It can form a very thin surface layer on the rough interface and is easy to rework. It is commonly used to fill the gap between power consumption electronic components and the radiator to improve the thermal conductivity of the radiator. .

In addition to high-performance chip and computer assembly applications, thermal paste has good applications in consumer electronics, Netcom equipment, automotive electronics, military industry, electronic instruments, etc., in addition to excellent thermal conductivity, because it can fully fill gaps and holes, So its thermal resistance is also lower than other thermal conductive materials.

Dongguan Shengyuan New Material Technology Co., Ltd. develops and produces SG560-50 thermal conductive paste with a thermal conductivity of 5W/MK. It has passed a 1000-hour reliability test and can fully fill the gaps and holes and reduce the contact thermal resistance between the two. Welcome to consult.