Thermal conductive materials in the heat conduction application of smart phones

The main body of smartphone heating is in the chip and battery pack. A common practice is to bond with the backplane. When excess heat is generated, the There is a gap between the heat sink and the heat sink. The air in the gap will hinder the heat transfer between the two, thereby reducing the heat dissipation effect.

In order to solve this problem, people’s common practice is to fill the gap between the heat source and the heat dissipation module with thermal conductive material, remove the air from the gap, and completely fill the gap pits, reduce the contact thermal resistance, and improve the heat transfer between the two. Efficiency, thereby improving the overall heat dissipation effect, so as to ensure that the phone runs at a suitable temperature, thereby ensuring its service life and safety.

Thermal conductive material is a new material specially used to solve the problem of heat conduction of equipment. There are many types, such as thermally conductive silicone sheet, non-silicon thermally conductive gasket, thermally conductive phase change film, thermally conductive silicone cloth, thermally conductive gel, thermally conductive silicone grease, carbon fiber Thermally conductive gaskets, etc., the current thermal conductivity of Thermal conductive material is 1-35W/MK, which satisfies most of the thermal conduction problem improvement solutions.