Application of thermal conductive materials in graphics cards

The heat dissipation method seen is to install a heat sink on the surface of the power consumption electronic components, and reduce the temperature of the heat source by guiding the heat from the surface of the heat source to the heat sink. However, there is a gap between the heat source and the heat sink, even if appropriate The gap can't be eliminated under the pressure of, so it is necessary to fill the thermal conductive material between the two contacts to reduce the contact thermal resistance between the two and improve the thermal conductivity.

Most discrete graphics cards have their own cooling fans, and the heat conductive sheet of the cooling fan is in contact with the chip inside the graphics card to reduce the temperature of the graphics card. In order to reduce the thermal resistance between the two, the chip surroundings and the chip surface are filled with thermal conductive material , Thereby improving the overall heat conduction effect, thereby increasing the heat conduction efficiency.