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At present, the mainstream is to install a thermal pad on the surface of the heat source of the device, and by guiding the heat to the pad, and then the pad to guide the heat to the shell, thereby reducing the internal temperature of the mobile phone. With the development of technology, the performance is stronger and the operation Faster CPUs continue to come out and have higher requirements for heat dissipation. Therefore, liquid cooling, graphene heat dissipation, VC soaking plate heat dissipation and other heat dissipation technologies have been continuously developed to provide more reliable protection for the operation of mobile phones.Finally,Sheen's thermal can alternative Laird's material.