High temperature has always affected the operation of the equipment, electronic components are easy to cause the equipment to crash or even spontaneous combustion under high temperature, so in order to ensure the normal operation of electronic equipment, heat dissipation is indispensable, in addition to the use of heat dissipation modules such as radiators, heat sink, thermal filling materials are also indispensable.
Currently on the market most of the thermal conductive filler material is based on the material of silicone oil, so use process inevitably there are small molecules siloxane, siloxane small molecule easily adsorbed on the surface element or contact surface heat dissipation, affect the performance of the equipment has the possibility of some electronic devices have extremely sensitive to silicon, so in order to ensure that heat will not affect performance at the same time, So there is Non silicon thermal conductive materials.
Non silicon thermal conductive materials and thermal conductive filler containing silicon commonly material difference between no special resin as base material of silicon thermal conductive materials, in use process will not have a siloxane separating out small molecules, of course, some people think that there is no silicon oil thermal conductive materials without precipitation, this idea is wrong, although no silicone oil precipitation of no silicon thermal conductive materials, but its still have oil precipitation, However, the operation of the device is not affected.
There are many silicon-free thermal conductivity materials, such as Non silicon thermal conductive materials, silicon-free thermal conductivity paste, silicon-free thermal conductivity gel and so on. There are different choices according to the operation environment of the products. It is suitable for the strict requirements of today's high-tech products on material pollution.