What is the working principle of thermally conductive phase change sheet?

The general heat dissipation system is caused by the heat dissipation module and the heat source of the device. By installing the heat dissipation module on or around the heat source, the heat is actively guided to the heat dissipation module, thereby reducing the temperature of the device. However, there is a gap between the heat source surface and the contact surface of the heat sink. Heat is transferred from the surface of the heat source to the radiator, and the heat transfer efficiency is affected by the resistance given by the air.

Thermally conductive phase change sheet is one of many thermally conductive materials, as it can effectively reduce the contact thermal resistance between the heat source and the radiator and improve the heat dissipation effect of the device, and the thermally conductive phase change sheet is different from other thermally conductive materials. The interface filling material with phase change capability, the Thermally conductive phase change sheet will become soft within the characteristic temperature range, but will not flow out of the interface, but will change from solid to thick semi-fluid paste, and will be filled as much as possible during the process. There is a gap between the heat source and the heat sink, thereby reducing the contact thermal resistance and improving the heat conduction efficiency.

The thermally conductive phase change sheet will become soft during the working process. As long as it stops working and the temperature returns to normal temperature, the thermally conductive phase change sheet will return to its original state. Compared with other thermally conductive materials, the thermally conductive phase change sheet has better thermal conductivity. It is used in high-performance chips and large-scale servers that have high requirements for heat dissipation.