Heat dissipation application case of thermal conductive gap filler in 5G mobile phone

5G communication technology needs to use antennas with higher frequencies to spread far away, but in the past, the composition density of electronic components is higher, and the heat generated during operation is much higher than that generated by 4G technology, so ordinary natural heat dissipation is not feasible , it is necessary to actively guide the heat to the outside to meet the cooling requirements of 5G.

5G mobile phones are the iconic products of 5G communication technology. In the early days, many 5G mobile phones had high temperature during use. In order to avoid damage to the chip, they were forced to return to the 4G network. This shows the importance of heat dissipation for 5G.


A common heat dissipation system is a cooling system composed of heat pipes, heat conducting sheets, and fans. Under the setting of mobile phones, the internal space design needs to consider many aspects. Usually, the heat dissipation method of 5G mobile phones is through the back of the mobile phone and the frame of the mobile phone. The heat sources of mobile phones are mainly chips, processors, and batteries, so by installing heat dissipation components above the heat source, the heat is actively guided to the outside.

In addition to heat dissipation components, the application of thermal conductive gap filler materials is also indispensable. The role of thermally conductive interface materials is very clear: to reduce the contact thermal resistance between the heat source of the mobile phone and the heat dissipation components. There is a gap between the 5G mobile phone and the heat dissipation component, and the heat will be blocked during conduction. Therefore, the thermal interface material can fill the gap between the two, remove the air in the gap, and reduce the contact thermal resistance between the two, thereby increasing the heat conduction speed.