Application of equipment heat dissipation and thermal conductive gel

Some people think that electronic devices will generate heat when they are used, so it is ok to let them not generate heat. However, heat generation when electronic devices are running is inevitable, because in reality the conversion of energy will be accompanied by loss. This part of the loss A large part of the energy is dissipated in the form of heat, so it is not feasible to eliminate the phenomenon of heat production.

Air is also a poor conductor of heat, and the heat transfer rate in the air is slow, so a radiator is needed. Install the radiator on the surface of the heat source of the equipment, and conduct the excess heat from the heat source into the radiator through surface-to-surface contact, thereby reducing the temperature of the heat source. However, there is a gap between the radiator and the heat source, and the heat will be affected by the air during heat conduction The rate of action is reduced, so a thermal interface material is used.

The thermally conductive interface material can effectively fill the gap between the heat sink and the heat source, remove the air in the gap, and reduce the contact thermal resistance between the interfaces, thereby improving the heat dissipation of the device.

Thermally conductive gel is a member of thermally conductive interface materials. In addition to high thermal conductivity and low interface thermal resistance, thermally conductive gel itself is a thick and semi-flowing paste. The gap can be quickly filled on the plane, and the thermal conductive gel also has many advantages, such as being applicable to a fully automated production process, convenient storage management, and so on.