Principle and Application of Thermal Conductive Phase Change Materials

The thermal conductive phase change material is a heat-enhancing polymer designed to minimize the thermal resistance between the consumable electronic device and its connection. This small thermal resistance channel optimizes the performance of the heat sink and improves It improves the reliability of microprocessor, memory module DC / DC converter and power module.
The key property of a thermal conductive phase change material is its phase change characteristics: at room temperature, the material is solid and easy to handle. It can be used as a dry pad to clean and solid, and used on the surface of a heat sink or device. When the device operating temperature is reached, the phase change material becomes softer and a little tighter, and the material is easily integrated with the two mating surfaces like hot grease. This ability to completely fill the interfacial air gap and the gap between the device and the heat sink makes the phase change pad better than non-flowing elastomers or graphite-based thermal pads and achieves properties similar to thermal grease.
 
Thermally conductive phase change materials are non-conductive, but since the material undergoes a phase change during normal heat sink installation, there may be metal-to-metal contact, so phase change materials cannot be used as electrical insulation. The small thermal resistance phase change interface pad is not a structural adhesive, and cannot directly connect the heat sink to the device. A clamp or other mechanical fastener must be used to maintain the clamping pressure of the heat sink to the device, so it is also called a phase change thermal insulation material.
 
What are the applications of phase change thermal insulation materials?
Phase change thermal insulation material is mainly used in high performance microprocessors and heating elements that require very low thermal resistance to ensure good heat dissipation. Phase-change thermally conductive insulating materials undergo a phase change at about 45-50. Under the action of pressure, it flows into and fills the irregular gap between the heating element and the radiator, squeezing away the air to form a good thermal interface.
 
Application:
1. Microprocessor, memory module and cache chip;
2, converters, and others;
3. Power semiconductor devices, solid state relays, bridge rectifiers.