What Is The Application Of Thermal Pad In Pcb

  Most of the electrical energy consumed by electronic devices during work, such as RF power amplifiers, FPGA chips, and power products, is converted into heat dissipation in addition to useful power. The heat generated by electronic equipment causes the internal temperature to rise rapidly. If this heat is not dissipated in time, the equipment will continue to heat up, the device will fail due to overheating, and the reliability of the electronic equipment will decline. SMT increases the installation density of electronic equipment, reduces the effective heat dissipation area, and the temperature rise of the equipment seriously affects reliability. Therefore, research on thermal design is very important.

  The heat dissipation of PCB circuit board is a very important link, so what are the heat dissipation skills of PCB circuit board, let's discuss together.

  When there are a few devices in the PCB with a large amount of heat (less than 3), a heat sink or a heat pipe can be added to the heating device. When the temperature cannot be lowered, a heat sink with a fan can be used to enhance heat dissipation effect. When there are many heating devices (more than 3), a large heat shield (board) can be used. It is a dedicated heat sink customized according to the position and height of the heating device on the PCB board or a large flat heat sink Cut out different component height positions. The heat sink is buckled on the surface of the component as a whole, and contacts each component to dissipate heat. However, the heat dissipation effect is not good due to the poor consistency of the components during assembly and welding. Generally, a soft thermal silica gel pad is added on the component surface to improve the heat dissipation effect.

  Sheen soft thermal pad is used to fill the air gap between the heating element and the heat sink or metal base. Their flexible and elastic characteristics make it suitable for covering very uneven surfaces. The heat is conducted from the discrete device or the entire PCB to the metal case or diffusion plate, which can improve the efficiency and service life of the heating electronic components.