Common Electronic Product Thermal Design Ideas

Natural cooling products

The core disadvantage of natural heat dissipation is poor heat dissipation. This means that when the power consumption density of electronic products increases, natural heat dissipation products will touch the "power consumption wall", and the heat dissipation problem will become a key technical problem of the product at a certain inflection point, and even become a core factor restricting the product experience. Before 2010, very few manufacturers focused on thermal design when promoting their products. Today, mobile phones, notebooks, automotive electronics, and even desktop computers are paying more and more attention to the advanced level of thermal design.

Due to comprehensive reasons, the specific optimization of the thermal design must be carried out in combination with the actual product situation. First, from the perspective of thermal design, list all possible thermal optimization solutions or efforts, and then analyze specific product characteristics, comprehensively consider all product level requirements such as appearance, structure, hardware, software, cost, time, and reliability, and finalize Implement feasible solutions.
When optimizing the heat dissipation of natural cooling products, you can consider the following aspects:

a) Enhanced radiant heat transfer-surface treatment with high emissivity in the infrared band;
b) Reduce the absorption of visible light-products that are directly exposed to the sun, reduce the absorption of visible light on the surface, including surface treatment, shading design, etc .;
c) Eliminate local hot spots and fully dissipate the heat of the heating source-the use of graphite sheets, copper foil, heat pipes, VCand other materials;
d) Selection of low thermal resistance interface materials-use high thermal conductivity silicone grease, thermal pad, thermal gel;
e) The unobstructed design of the air duct-convective heat exchange is also dominant in natural heat dissipation, and the air duct needs to be designed in accordance with the heat exchange characteristics;
f) Optimized use of heat dissipation structural components-including optimization of structural parameters of heat dissipation components, optimization of materials, and full use of structural components in the product to achieve heat dissipation effects;
g) Increase surface heat exchange area-use larger product size, equipment surface using fins, etc .;
h) Coordination of circuit board design-coordination of chip layout, design of thermal vias, copper design;
i) Coordination of software design-product operation load combined with temperature for dynamic and intelligent control, making full use of all cooling potentials;
j) the use of phase change energy storage materials-rapid absorption of excess heat in order to maintain product temperature under sudden power consumption conditions;
k) Component screening-use components with low thermal resistance and high temperature specifications.