5G Market, Who Is The Best Thermal Conductive Material?

Sheen Graphite film: mainstream material for thermal solutions Mainstream heat dissipation material, 3 ~ 6 pieces for single phone Graphite is a better thermal conductive material than metals such as copper and aluminum. The main reason is that graphite has a special hexagonal planar network structure that can evenly distribute heat on a two-dimensional plane and effectively transfer it. In the horizontal direction, the thermal conductivity of graphite film is 300 ~ 1900W / (m〃K), while the thermal conductivity of copper and aluminum is about 200 ~ 400W / (m〃K). Based on performance advantages such as high thermal conductivity, high specific heat capacity, and low density, graphite has been used in consumer electronics in bulk since 2009, and has been widely used in smartphones since 2011. It has now replaced traditional metals and become the mainstream thermal conductive material in the consumer electronics field. Theoretically, the thinner the Sheen graphite film, the higher the thermal conductivity. The early graphite film thickness was mainly between 20 ~ 50µm, and its thermal conductivity on the horizontal axis was between 300 ~ 1,500W / (m〃K). With the improvement of technology, the processing technology of graphite film is more mature, the thinnest can be 0.01mm, and the thermal conductivity of its horizontal axis is as high as 1,900W / (m〃K). (1) Natural graphite film: Made entirely of natural graphite, no degassing will occur under vacuum conditions, and it can continue to be used at temperatures above 400 ° C, with a minimum of about 0.1mm. It is mainly used in data centers, Base stations and charging stations. (2) Artificial graphite heat dissipation film: made of polyimide (PI film) through carbonization and graphitization. It is currently the thinnest heat dissipation film material, the thinnest can be 0.01mm, widely used in mobile phones, computers and other smart End products. (3) Nano-carbon heat-dissipating film: made of nano-carbon (graphite isomers), the thinnest can be 0.03mm, and the heat dissipation power can be as high as 1000 ~ 6000. Because the nano-carbon heat-dissipating film has simple processing steps, only mold opening and die cutting are needed, and the cost is low and the price is low.