5G era, thermal gel has great promise

Before the introduction of thermal gels, thermal pad were one of the materials commonly used in the thermal and thermal market. It can be said that thermal pads have solved a large number of heat transfer problems in the past many years. The development of science and technology is changing with each passing day. The functions of electronic products have been integrated. The thermally conductive circuit boards are getting smaller and smaller, but the electronic components are getting more and more. The heat source of the circuit board is too concentrated, the space between the heat sources is different, the shapes are different, and the power of the electronic products is getting larger and larger, so the requirements for the thermally conductive materials are getting higher and higher. More and more heat conduction problems can no longer be satisfied by a single thickness of thermal pad. The thermal pad requires a certain assembly pressure during the assembly process, and it will inevitably generate a certain stress on the circuit board. In use scenarios that require extremely low stress, the hardness of the thermal silicone pad is as low as possible, but the hardness is extremely low. In the case of heat transfer, there will be mucous membranes and deformation, which makes the operation difficult.
                                                                                          

Dongguan Sheen Electronic Technology Co., Ltd. independently developed and produced the thermal gel, which is a new type of gel-like thermally conductive material made of silica gel composite thermally conductive filler, which is stirred, mixed and encapsulated. Adopt the glue type design, use the mixed glue nozzle when using, and can realize the automatic production at the same time, it is very convenient. The biggest advantage of two-component thermally conductive gels compared to thermally conductive silicone sheets is that thermally conductive gel can be filled with various irregular shapes, and the assembly stress is extremely low, and the hardness is very low after vulcanization. In comparison, Thermally conductive gels are more diversified in formula design and can improve the stability of circuit boards. In terms of material utilization, the thermal conductive silicone sheet will have problems such as unqualified size and loss of cutting edges during the molding and cutting process, and the thermal conductive gel can accurately control the amount of dispensing through the automatic dispenser, regardless of the material. The utilization rate is still easier to use than the thermally conductive sheet.

 In the 5G era, automated production will become more common. At this time, two-component thermally conductive gels are the most suitable choice.