English
usheenthermal
alibaba
In the current era of rapid technological advancement, electronic devices are iterating at an unprecedented pace. From high-performance smartphones and versatile tablets to efficient laptops and ultimate-experience game consoles, their performance is constantly improving. However, as chip computing speeds accelerate and functions become more complex, the heat generated during device operation is growing exponentially. How to achieve efficient heat dissipation has become a key factor determining whether the performance of electronic devices can continue to improve and their service life can be extended. In this critical field, our company, with its profound accumulation in the research, development and production of thermal conductive materials, has injected strong impetus into the breakthrough of electronic device performance.
Since its establishment in 2008, our company has been committed to the research, development, production and sales of thermal interface materials, thermal insulation materials and silicone products. After years of technical expertise and market expansion, our products have been widely used in electric vehicles, sensors, power supplies, medical equipment and LED fields, becoming a trusted partner of many well-known manufacturers worldwide. The company strictly follows quality and environmental management standards and has obtained authoritative certifications such as ISO 9001:2015, ISO 14001:2015 and IATF 16949:2016. This is not only a high recognition of the company's product quality and environmental protection concepts, but also a strong guarantee for us to continue to provide high-quality products and services to customers.
In the context of the increasing heat dissipation demand of electronic devices, thermal conductive materials, as a key bridge connecting heat sources and cooling devices, their performance directly affects the heat dissipation efficiency of devices. Take smart phones as an example, today's flagship models are equipped with high-performance processors. When running large-scale games and multitasking, the heat generated by the chip increases exponentially. If this heat cannot be exported in time and effectively, the chip will trigger the frequency reduction protection mechanism due to overheating, resulting in slow operation of the mobile phone, stuck pictures and seriously affecting the user experience. At this critical moment, our high-performance thermal pads can play a key role. Our thermal pads have an ultra-high thermal conductivity, up to 45.0W/m・K, which can quickly transfer the heat generated by the chip to the heat dissipation structure of the mobile phone, such as graphite heat sinks and vapor chambers. Through these heat dissipation structures, the heat is evenly dispersed and exported from the body, ensuring that the chip is always at a suitable working temperature and maintaining the high-performance operation of the mobile phone.
In the field of laptops, with the continuous development of lightweight design trends, the internal space is becoming more and more compact, leaving very limited space for the cooling system. This puts forward higher requirements for the performance of thermal conductive materials, which should not only have excellent thermal conductivity, but also achieve efficient heat dissipation in a narrow space. Our advanced phase change materials show unique advantages in this scenario. When absorbing heat to a specific temperature, this kind of material will undergo a state change, from solid to liquid. In this process, it absorbs and stores a lot of heat, while maintaining a constant temperature. When the temperature drops, it will change from liquid to solid, releasing the stored heat. Using this characteristic, phase change materials can effectively buffer the instantaneous high temperature generated by laptops during high-load operation. Cooperating with other heat dissipation components such as thermal grease and cooling fans, they can achieve all-round and efficient heat dissipation of core components such as processors and graphics cards, allowing laptops to stably exert strong performance in lightweight bodies.
In addition to consumer electronic devices, our thermal conductive materials also perform well in the industrial electronics field with high requirements for reliability and stability. In industrial automation production, various motor drivers, industrial computers and telecommunication equipment run continuously for a long time. If the generated heat cannot be properly handled, it may cause equipment failure and affect the normal operation of the entire production line. We have developed thermal conductive materials with good chemical compatibility, which can adapt to complex temperature cycles and high humidity environments according to the characteristics of industrial environments. For example, the thermal gel customized for industrial power supplies not only has excellent thermal conductivity, but also has excellent chemical corrosion resistance. It can work stably in harsh industrial environments, ensure efficient heat dissipation of power modules and guarantee reliable operation of equipment.
Over the years, the company has made continuous innovations and breakthroughs in the field of thermal conductive materials, with a rich and diverse product line. There are various thermal pads suitable for different scenarios, including silicone-based thermal pads, carbon fiber thermal pads, silicone-free thermal pads, etc., as well as phase change materials with unique properties, and liquid thermal conductive materials with good filling performance, such as thermal grease and thermal gel. Moreover, we can also provide customized material formulas according to the special needs of customers to ensure that each application scenario can get the most suitable heat dissipation solution.
In the future, with the in-depth development of emerging technologies such as 5G communication technology, artificial intelligence and the Internet of Things, electronic devices will move towards more miniaturization and high performance, and the heat dissipation demand will become more urgent. Our company will continue to uphold the spirit of innovation, increase research and development investment, deeply explore new thermal conductive materials and technologies, and constantly improve product performance and quality. We will provide solid technical support for the continuous development of the electronic equipment industry, help various electronic devices continue to break through in performance improvement, and bring users a more excellent experience.
