Selection of the role of thermal silicone pad and radiator

In the initial stage of product design, a thermally conductive silicone sheet must be added to the product's structural design. It is required that the thermally conductive silicone sheet can perfectly solve the heat conduction problem of the product, and can fit the product design and facilitate installation.

First, if you choose a heat sink solution, you can use thermally conductive double-sided adhesive, thermally conductive silicone grease and other thermally conductive materials. However, the thermal conductivity of thermally conductive double-sided adhesive is relatively poor; thermally conductive silicone grease does not have shock absorption and compression resistance; light and thin thermally conductive silicone sheets can be selected for better heat dissipation and convenient operation.

Second, the choice of thermal solution: the development trend of electronic products is becoming increasingly thinner and thinner. In the past, the heat conduction method was mainly based on the heat sink solution. With the development of electronic product thermal technology, metal brackets and metal shells are more used The main structural heat sink; or a combination of the two solutions; In short, under different products and different use environments, choose the best cost-effective thermal solution, and use the thermal conductive silicone sheet perfectly.

Third, when choosing structural parts for heat dissipation, it is unavoidable to combine the thermally conductive silicone sheet with the protrusion of the thermally conductive radiator at the contact surface and so on. Under the conditions allowed by the product design, try to choose a non-thick thermally conductive silicone sheet.