Notebook cooling depends on workmanship and details in addition to design

When it comes to notebook casings, many people think that a casing with a high thermal conductivity is conducive to cooling the notebook. So, can a casing with high thermal conductivity serve as a heat sink for an ultrabook? In fact, we can see that the manufacturer did not attach the notebook heat sink to the case. Why? The reason is very simple. If you do this, the high temperature of 60-70 ° C on the heat sink will be transmitted to the shell, which is far from normal use.
    
Of course, high thermal conductivity housings such as aluminum alloys are not entirely useless. After all, notebooks not only heat chips and graphics cards, but also many components inside them. In this case, aluminum alloy housings can rely on their high thermal conductivity. It can remove the heat of these low-heat-generating components to avoid heat accumulation and cause local overheating or instability.
  
 In fact, in addition to the appearance design, the workmanship and details of the heat dissipation system determine the heat dissipation effect of the ultrabook. Imagine if the heat pipe of the ultrabook has poor workmanship and poor thermal conductivity, and the fan speed is high, the noise will be huge, and Can cause ultrabook resonance. If the heat sink's fins are sparse and the process is not good, no matter how good the heat dissipation scheme is, it is useless. In fact, this is also the difference between many ultrabooks' heat dissipation designs, but the actual heat dissipation effect is so different. The reason is nothing more than cost control. How to solve it must be clear to manufacturers.