Thermal paste (also known as thermal paste, thermally conductive silicone, high thermal paste, wafer thermal paste) is a viscous fluid substance that fills incompletely flat and smooth surfaces between components. The compound has greater heat than air The conductivity can effectively improve the heat dissipation effect of the component.
The principle and theoretical framework of the heat pipe and the (VC) Vapor Chamber are the same, only the heat conduction method is different. The heat conduction method of the heat pipe is one-dimensional linear conduction, while the heat conduction method of the Vapor Chamber is two-dimensional surface conduction, so higher efficiency.