Thermal paste (also known as thermal paste, thermally conductive silicone, high thermal paste, wafer thermal paste) is a viscous fluid substance that fills incompletely flat and smooth surfaces between components. The compound has greater heat than air The conductivity can effectively improve the heat dissipation effect of the component.
The principle and theoretical framework of the heat pipe and the (VC) Vapor Chamber are the same, only the heat conduction method is different. The heat conduction method of the heat pipe is one-dimensional linear conduction, while the heat conduction method of the Vapor Chamber is two-dimensional surface conduction, so higher efficiency.
The thermally conductive phase change material is a heat-enhancing polymer. The thermally conductive phase change material is a solid sheet at room temperature, with a thin thickness, strong operability, and easy installation. It is used between a heat sink and a power-consuming electronic device.
The degree of oil separation determines the life of the thermal paste. Thermal paste is a mixture. The role of silicone oil is to make the thermal paste have fluidity and fill the gap. If the oil is too high, the thermal paste will dry out easily, causing a gap between the CPU and the heat sink to conduct heat.