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The thermal conductive material reduces the contact thermal resistance between the heat source and the radiator, so that the heat source and the radiator can be in close contact, thereby improving the heat transfer efficiency, and the thermal conductive paste is one of the traditional thermal conductive materials widely used in the field of thermal conductive materials. With the appearance of thermal gel in recent years, it has been proposed that thermal paste may be replaced by thermal gel, but thermal paste is still the choice of many engineers due to its excellent performance. So what is thermal paste? What should I pay attention to when using?
Severe heating of equipment is a phenomenon that people often come into contact with. A large amount of heat is generated when current flows through resistors. This is one of the main reasons for heating of electrical equipment. The internal space of the equipment is relatively small, especially for consumer electronic products such as mobile phones and tablet computers. , Notebooks, game consoles, etc., the internal space design is more compact, and the air is a poor conductor of heat, the heat on the surface of the heat cannot be effectively transferred to the outside, causing heat to accumulate around the heat source, resulting in excessive temperature and damage to parts . Mounting a radiator on the surface of a heat source is a common way to dissipate heat at present, but if only a radiator is installed, the heat dissipation effect will be very low, and the expected effect will not be achieved, because there are many large and small gaps between the heat When the surface is transferred to the surface of the radiator, there is a large amount of air in the gap, which reduces the efficiency of heat transfer. Therefore, it is necessary to fill the heat transfer material between the radiator and the heat source to fill the gap between the heat source and the radiator, and make the heat source and the radiator Can be in close contact, thereby improving the efficiency of heat conduction.
Many electronic products or machinery and equipment have a problem: heat generation during operation. The heating of machinery and equipment is mainly due to the heat generated when the current passes through the resistor. Under normal circumstances, the heat will be transferred to the outside through the air, but the air is a poor conductor of heat. The efficiency of heat transfer in the air is very low, so the heat source is generally installed on the surface In order to improve the heat dissipation effect. However, if the heat sink is installed alone, the heat dissipation effect is not good. Because the heat sink and the heat source have large and small holes, the heat transfer process needs to pass through the air to contact the heat sink, so the heat dissipation effect is low. The heat-conducting material is filled between the heat sink and the heat source, and the large and small pits between the gaps are filled to remove the air between the gaps, so that the radiator and the heat source can be in close contact and improve the heat transfer efficiency.
Thermal conductive material is a medium material that solves the heat dissipation problem. It acts to fill the gap between the heat source and the radiator to eliminate the air in the gap, so that the heat source and the radiator can be in close contact, thereby improving the heat transfer efficiency. Most of the thermal conductive materials on the market Silicone oil is used as the raw material. During long-term use, silicone oil will be precipitated, and volatiles will attach to electronic components, optical windows, PCB board electronic components and other parts, causing pollution to them and affecting product accuracy and reliability .
At present, most of the mobile phones used by people are 4G smart phones. With the gradual improvement of the 5G infrastructure, 5G mobile phones have also begun to enter the market. With the enhancement of product functions and the increasing requirements of users for processing speed, products require Consumption is also increasing, making thermal management pay more and more attention to the use time and performance of products. The application of 5G network means that data transmission will achieve a qualitative leap. It also means that processors and power-consumption components will gain performance. At the same time, its products will face greater heat dissipation problems. The greater the power consumption, the more heat it dissipates. The higher the heat, and heat is a key factor affecting the service life of the product, so this problem must be solved.
Power consumption electronic components generate heat when the current passes through the resistor during the power-on operation. Excessive temperature may cause the components to be burned, which affects the reliability and safety of the product. Therefore, timely heat dissipation is electronic products and electrical equipment The problem that needs to be solved.
A common heat dissipation system is composed of a radiator and a heat source, and under normal circumstances, when the radiator is installed, a thermal conductive material is filled between the heat source and the radiator, because there is a gap between the radiator and the heat source, even if the two are smooth and flat. There are still some large and small pits invisible to the naked eye. When heat is transferred from the surface of the heating source to the radiator, it will pass through the air, and air is a poor conductor of heat, so the heat transfer efficiency is reduced, and the purpose of filling the thermal conductive material It can effectively cover the pits in the gap, reduce thermal resistance, and improve thermal conductivity.
The current common form of heat dissipation is natural heat dissipation, but this has a lower heat dissipation effect. If you encounter machinery and equipment with high power consumption, the internal temperature cannot be effectively reduced. Therefore, under normal circumstances, a heat sink is installed on the surface of the heat source. Direct heat to the radiator, so that the device can work for a long time. If the radiator is directly installed on the surface of the heating source, the heat dissipation efficiency will be low, mainly because the surface of the radiator or the heating source has some large and small pits or irregular planes. The air is a poor conductor of heat, so the heat transfer process The efficiency of the medium is reduced and cannot be quickly transferred to the radiator. Here, a thermally conductive insulating material is required.
In modern society, the importance of electronic equipment has become more and more popular, and the good or bad heat dissipation will affect the stability of thermally conductive electronic equipment. Thermally conductive materials and heat dissipation accessories play an indispensable role in electronic equipment. The form of heat dissipation of electronic equipment There are many types. Natural heat dissipation is the main one, which relies heavily on thermally conductive materials and accessories. With the improvement and upgrade of the application performance of electronic equipment in various fields, the upgrade and progress in the field of thermally conductive materials are driven.
Thermal conductive material is the name of a material used to fill the gap between the heat sink and the heating device to reduce the contact thermal resistance between them. The common heat dissipation component on the market is composed of the heat sink and the heating device. If the two are in direct contact, the two There are inevitably gaps that are difficult to observe with the naked eye. These gaps are filled with air, and the efficiency of heat conduction in the air is very low, much lower than that of solid materials, which leads to poor heat dissipation.
It is well known that thermal conductive material is a material that solves the heat dissipation problem of machinery and equipment, and its main function is to fill the gap between the heat source and the radiator, remove the air between the gaps (air is a poor conductor of heat), reduce contact resistance, and increase heat. The efficiency of conduction can improve the heat dissipation effect.
Computer heating is a relatively common thing. The main reason is that the internal power consumption electronic components of the computer generate heat during operation. If the temperature is not controlled in time, people often say that the CPU, the graphics card, the motherboard, etc. are short circuit Causes equipment damage, so it is necessary to install a heat sink on the power consumption electronic components to conduct heat to the heat sink in a timely manner.
Every step in the world has its own value. Even if it is optimized later, it only exists because it can improve efficiency or reduce costs, not because it is useless at the beginning. When improving, you need to consider the significance of each step, either improve or delete.
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